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LCY-H9PP Datasheet with Chat AI
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    Hello, Please ask a question about LCY-H9PP Datasheet

  • # Example questions: ➢ What is the recommended reflow soldering peak temperature?
    ➢ What does the document state regarding the moisture sensitivity of the product and how is it addressed during packaging?
    ➢ What type of atmospheric conditions are recommended during the soldering process to achieve superior solder joint connectivity?

  • Part No.LCY-H9PP
    ManufacturerOSRAM
    Size1Mb
    Pages23 pages
    DescriptionSMD epoxy package
    Datasheet Summary with AI

    1. General Information & Identification:

    ️· Product Type: High-performance LED (OSLON derivative)
    ️· Version: Version 1.7
    ️· Document Purpose: Datasheet providing specifications, application details, and handling instructions.

    2. Electrical/Optical Characteristics (Not detailed, but implied):

    ️· The datasheet is focused on handling, packaging, and environmental considerations, suggesting detailed electrical and optical data is available elsewhere. Keywords like "peak temperature" and "ramp-up rate" in the reflow soldering profile imply specifics around operating conditions.

    3. Handling and Environmental Considerations (Primary Focus):

    ️· Moisture Sensitivity: The LED is moisture-sensitive and is packed in a dry bag with desiccant and a humidity card (Dry Pack process). This is critical for proper handling.
    ️· ESD Protection: An ESD device is connected in parallel to the LED chip, requiring careful handling to avoid electrostatic discharge damage.
    ️· Corrosion Robustness: The LED is tested to withstand harsh environments (humidity, hydrogen sulfide exposure), meeting or exceeding industry standards.
    ️· Soldering:
    - Reflow soldering is the recommended method.
    - A detailed reflow soldering profile is provided, including temperature ramps, peak temperatures, and time limits.
    - Nitrogen atmosphere during soldering is recommended.
    - The heat sink must *not* be electrically connected to the anode or cathode solder pads to accommodate future OSLON variants.
    ️· Cleaning: Ultrasonic cleaning is *not* recommended.

    4. Packaging and Logistics:

    ️· Taping: The LED is available on a 12mm tape, with 2000 pieces per 180mm reel.
    ️· Transportation: Packaged in a cardboard box (dimensions provided).
    ️· Barcode Label (BPL): A barcode label is applied for product identification and traceability.

    5. Drawings/Diagrams (Implied):

    ️· The document likely contains several diagrams and drawings:
    - Reflow soldering profile graphs.
    - Taping dimensions.
    - Reel dimensions.
    - Transportation box dimensions.
    - Recommended solder pad layout.

    1. General Information & Identification:

    ️· Product Type: High-performance LED (OSLON derivative)
    ️· Version: Version 1.7
    ️· Document Purpose: Datasheet providing specifications, application details, and handling instructions.

    2. Electrical/Optical Characteristics (Not detailed, but implied):

    ️· The datasheet is focused on handling, packaging, and environmental considerations, suggesting detailed electrical and optical data is available elsewhere. Keywords like "peak temperature" and "ramp-up rate" in the reflow soldering profile imply specifics around operating conditions.

    3. Handling and Environmental Considerations (Primary Focus):

    ️· Moisture Sensitivity: The LED is moisture-sensitive and is packed in a dry bag with desiccant and a humidity card (Dry Pack process). This is critical for proper handling.
    ️· ESD Protection: An ESD device is connected in parallel to the LED chip, requiring careful handling to avoid electrostatic discharge damage.
    ️· Corrosion Robustness: The LED is tested to withstand harsh environments (humidity, hydrogen sulfide exposure), meeting or exceeding industry standards.
    ️· Soldering:
    - Reflow soldering is the recommended method.
    - A detailed reflow soldering profile is provided, including temperature ramps, peak temperatures, and time limits.
    - Nitrogen atmosphere during soldering is recommended.
    - The heat sink must *not* be electrically connected to the anode or cathode solder pads to accommodate future OSLON variants.
    ️· Cleaning: Ultrasonic cleaning is *not* recommended.

    4. Packaging and Logistics:

    ️· Taping: The LED is available on a 12mm tape, with 2000 pieces per 180mm reel.
    ️· Transportation: Packaged in a cardboard box (dimensions provided).
    ️· Barcode Label (BPL): A barcode label is applied for product identification and traceability.

    5. Drawings/Diagrams (Implied):

    ️· The document likely contains several diagrams and drawings:
    - Reflow soldering profile graphs.
    - Taping dimensions.
    - Reel dimensions.
    - Transportation box dimensions.
    - Recommended solder pad layout.

    Part No.LCY-H9PP
    ManufacturerOSRAM
    Size1Mb
    Pages23 pages
    DescriptionSMD epoxy package
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