1. Overview & Functionality

️· What it is: The PCA82C251 is a High-Speed CAN (Controller Area Network) Transceiver. CAN is a robust communication standard commonly used in automotive, industrial, and other applications requiring reliable data exchange between devices.
️· Key Features:
- High-speed operation (up to 1 Mbps)
- Compliant with CAN 2.0A and 2.0B standards
- Various protection features (Over Voltage, Reverse Voltage, Short Circuit)
- Flexible interrupt generation
- Multiple operating modes (Normal, Standby, Shutdown)
- Sleep mode for power saving
- Single power supply operation (3.3V or 5V)
- Multiple package options (including DIP, SO, and TSSOP)

2. Electrical Characteristics

️· Voltage: Supports both 3.3V and 5V logic.
️· Operating Temperature: -40°C to 125°C
️· Current Consumption: Data on standby current, operating current, etc. is available in the table of Electrical Characteristics.
️· CAN High and Low Driver Capabilities: Includes data regarding the common mode input voltage, output drive capability, and other related parameters.

3. Pinout & Functionality

️· CANH & CANL: Differential signals for CAN communication.
️· TX/RX: Transmit and Receive pins.
️· STANDBY: Places the transceiver into a standby mode.
️· SHUTDOWN: Puts the device in a shutdown mode, disabling all functions.
️· INT: Interrupt output for signalling events.
️· Power supply (GND, VCC).
- Detailed descriptions of pin functions are within the datasheet.

4. Quick Reference Data
️· Propagation Delay: tPD = 24ns

5. Package Information

️· Available Packages: The data sheet lists several package options, including:
- DIP8 (Dual In-Line Package)
- SO8 (Small Outline Package)
- TSSOP (Thin Shrink Small Outline Package)
️· Package Dimensions: Detailed package outlines and dimensions are provided for each package type.

6. Important Notes – Discontinued/No Longer Available

️· DIP8 Package: No longer available.
️· Bare Die: No longer available.

7. Soldering Information

️· Wave Soldering: Suitable for through-hole and SMDs.
️· Reflow Soldering: Suitable for small pitches and high densities. Specific temperature profiles and guidelines are provided.
️· Moisture Sensitivity: Precautions must be taken regarding moisture during handling and soldering.

8. Revision History
️· The format of the document has been redesigned to comply with new company guidelines.
️· Legal texts updated.
️· DIP8 package discontinued.
️· Bare die discontinued.