# Texas Instruments Package Option Addendum

## Packaging Information
General Notes
️· Document details packaging options for TI components.
️· Includes details on active, lifebuy, NRND, preview, and obsolete statuses.
️· Provides details regarding Eco Plan (Pb-Free, RoHS Exempt, Green).
️· Defines Moisture Sensitivity Level (MSL) and peak temperature.
️· Highlights potential additional marking on devices.

## Mechanical Data
Package Outlines
️· Detailed mechanical drawings and dimensions for various package types:
- Ceramic Dual-In-Line Package (J, R-GDIP-T**)
- Ceramic Dual Flatpack (W, R-GDFP-F24)
- Plastic Dual-In-Line (N, R–PDIP–T24)
️· Dimensional data includes pin counts, lengths, widths, heights, and seating planes.
️· Drawings include notes on tolerances and materials.

## Tape and Reel Information

️· Details on tape and reel specifications:
- Package type, pins, SPQ (Sample Package Quantity).
- Reel diameter, width, A0, B0, K0, P1, W, and Pin 1 Quadrant.

## Important Notices & Disclaimer
️· Standard disclaimer regarding corrections, enhancements, and discontinuation of products.
️· Warranty information and limitations of liability.
️· Safety-critical application warnings.
️· Links to TI’s website and online communities.
️· Contact and copyright information.