| Fabricante Electrónico | No. de pieza | Datasheet | Descripción Electrónicos |
Molex Electronics Ltd.
|
1719750203 |
47Kb/2P |
2.54mm Pitch SL Header, Single Row, Right-Angle, LCP, Shrouded, Through Hole,with Pegs, 0.75關m Selective Gold (Au) Plating, 3 Circuits |
| 1719750217 |
47Kb/2P |
2.54mm Pitch SL Header, Single Row, Right-Angle, LCP, Shrouded, Through Hole,with Pegs, 0.75關m Selective Gold (Au) Plating, 17 Circuits |
| 1719750223 |
47Kb/2P |
2.54mm Pitch SL Header, Single Row, Right-Angle, LCP, Shrouded, Through Hole,with Pegs, 0.75關m Selective Gold (Au) Plating, 23 Circuits |
| 0010897160 |
432Kb/4P |
2.54mm (.100") Pitch C-Grid짰 Breakaway Header, Dual Row, Vertical, High Temperature, 16 Circuits, 0.76關m (30關") Gold (Au) Selective Plating |
| 0010897780 |
432Kb/4P |
2.54mm (.100") Pitch C-Grid짰 Breakaway Header, Dual Row, Vertical, High Temperature, 78 Circuits, 0.76關m (30關") Gold (Au) Selective Plating |
| 0010897260 |
432Kb/4P |
2.54mm (.100") Pitch C-Grid짰 Breakaway Header, Dual Row, Vertical, High Temperature, 26 Circuits, 0.76關m (30關") Gold (Au) Selective Plating |
| 0010897560 |
432Kb/4P |
2.54mm (.100") Pitch C-Grid짰 Breakaway Header, Dual Row, Vertical, High Temperature, 56 Circuits, 0.76關m (30關") Gold (Au) Selective Plating |
| 0010897042 |
432Kb/4P |
2.54mm (.100") Pitch C-Grid짰 Breakaway Header, Dual Row, Vertical, High Temperature, 4 Circuits, 0.38關m (15關") Gold (Au) Selective Plating |
| 0010897480 |
432Kb/4P |
2.54mm (.100") Pitch C-Grid짰 Breakaway Header, Dual Row, Vertical, High Temperature, 48 Circuits, 0.76關m (30關") Gold (Au) Selective Plating |
| 0010897502 |
432Kb/4P |
2.54mm (.100") Pitch C-Grid짰 Breakaway Header, Dual Row, Vertical, High Temperature, 50 Circuits, 0.38關m (15關") Gold (Au) Selective Plating |
| 0010977486 |
432Kb/4P |
2.54mm (.100") Pitch C-Grid짰 Breakaway Header, Dual Row, Vertical, High Temperature, 48 Circuits, 0.38關m (15關") Gold (Au) Selective Plating |
| 0010897362 |
433Kb/4P |
2.54mm (.100") Pitch C-Grid짰 Breakaway Header, Dual Row, Vertical, High Temperature, 36 Circuits, 0.38關m (15關") Gold (Au) Selective Plating |
| 0010897222 |
433Kb/4P |
2.54mm (.100") Pitch C-Grid짰 Breakaway Header, Dual Row, Vertical, High Temperature, 22 Circuits, 0.38關m (15關") Gold (Au) Selective Plating |
| 0010897140 |
432Kb/4P |
2.54mm (.100") Pitch C-Grid짰 Breakaway Header, Dual Row, Vertical, High Temperature, 14 Circuits, 0.76關m (30關") Gold (Au) Selective Plating |
| 0010897740 |
432Kb/4P |
2.54mm (.100") Pitch C-Grid짰 Breakaway Header, Dual Row, Vertical, High Temperature, 74 Circuits, 0.76關m (30關") Gold (Au) Selective Plating |
| 0010977426 |
433Kb/4P |
2.54mm (.100") Pitch C-Grid짰 Breakaway Header, Dual Row, Vertical, High Temperature, 42 Circuits, 0.38關m (15關") Gold (Au) Selective Plating |
| 0010897320 |
432Kb/4P |
2.54mm (.100") Pitch C-Grid짰 Breakaway Header, Dual Row, Vertical, High Temperature, 32 Circuits, 0.76關m (30關") Gold (Au) Selective Plating |
| 1719730703 |
47Kb/2P |
2.54mm Pitch SL Header, Single Row, Vertical, LCP, Shrouded, Surface Mount, 0.38關m Selective Gold (Au) Plating, 3 Circuits, Tape and Reel |
| 1719730707 |
47Kb/2P |
2.54mm Pitch SL Header, Single Row, Vertical, LCP, Shrouded, Surface Mount 0.38關m Selective Gold (Au) Plating, 7 Circuits, Tape and Ree |
| 1719730708 |
47Kb/2P |
2.54mm Pitch SL Header, Single Row, Vertical, LCP, Shrouded, Surface Mount, 0.38關m Selective Gold (Au) Plating, 8 Circuits, Tape and Reel |
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