| Fabricante Electrónico | No. de pieza | Datasheet | Descripción Electrónicos |
Molex Electronics Ltd.
|
0757840122 |
1Mb/14P |
0.80mm (.031) Pitch, iPass??I/O SMT Receptacle, Vertical, Internal Application, 36 Circuit, 0.76關m (30關) Gold (Au), SMT Shell, Left Key |
| 0753417664 |
315Kb/6P |
1.85mm by 1.85mm (.073 by .073) Pitch 4-Pair GbX짰 Backplane Connector System, Power Module, 12 Circuits, 1.27關m (50關) Gold (Au) |
| 0753417744 |
315Kb/6P |
1.85mm by 1.85mm (.073 by .073) Pitch 4-Pair GbX짰 Backplane Connector System, Power Module, 12 Circuits, 1.27關m (50關) Gold (Au) |
| 0877580650 |
147Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Through Hole, Vertical, 6 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Tray Packaging, Lead-free |
| 0753414777 |
315Kb/6P |
1.85mm by 1.85mm (.073 by .073) Pitch 4-Pair GbX짰 Backplane Connector System, Power Module, 12 Circuits, 1.27關m (50關) Gold (Au) |
| 0753414646 |
315Kb/6P |
1.85mm by 1.85mm (.073 by .073") Pitch 4-Pair GbX짰 Backplane Connector System, Power Module, 12 Circuits, 1.27關m (50關") Gold (Au) |
| 0850033378 |
73Kb/3P |
2.54mm (.100") Pitch DIN 41612 C Style Male Header, Right Angle, Through Hole, 0.60關m (24關") Selective Gold (Au) Plating, 96 Circuits |
| 0753417666 |
315Kb/6P |
1.85mm by 1.85mm (.073 by .073") Pitch 4-Pair GbX짰 Backplane Connector System, Power Module, 12 Circuits, 1.27關m (50關") Gold (Au) |
| 0753414647 |
315Kb/6P |
1.85mm by 1.85mm (.073 by .073") Pitch 4-Pair GbX짰 Backplane Connector System,Power Module, 12 Circuits, 1.27關m (50關") Gold (Au |
| 0757830123 |
1Mb/14P |
0.80mm (.031") Pitch, iPass??I/O SMT Receptacle, Right Angle, Internal Application36 Circuit, 0.76關m (30關") Gold (Au), SMT Shell, Right Key |
| 0850030189 |
87Kb/3P |
2.54mm (.100") Pitch DIN 41612 Header, Style C, Right Angle, Through Hole, 0.6關m(24關") Selective Gold (Au), 96 Circuits, Lead free |
| 0753416444 |
315Kb/6P |
1.85mm by 1.85mm (.073 by .073) Pitch 4-Pair GbX짰 Backplane Connector System, Power Module, 12 Circuits, 1.27關m (50關) Gold (Au) |
| 0753427766 |
316Kb/6P |
1.85mm by 1.85mm (.073 by .073) Pitch 4-Pair GbX짰 Backplane Connector System, Power Module, 16 Circuits, 1.27關m (50關) Gold (Au) |
| 0754921076 |
281Kb/6P |
1.85mm by 1.85mm (.073 by .073) Pitch 2-Pair GbX짰 Backplane Connector System, Power Module, 4 Circuits, 1.27關m (50關) Gold (Au) |
| 0753416666 |
315Kb/6P |
1.85mm by 1.85mm (.073 by .073) Pitch 4-Pair GbX짰 Backplane Connector System, Power Module, 12 Circuits, 1.27關m (50關) Gold (Au) |
| 0754921047 |
281Kb/6P |
1.85mm by 1.85mm (.073 by .073) Pitch 2-Pair GbX짰 Backplane Connector System, Power Module, 4 Circuits, 1.27關m (50關) Gold (Au) |
| 0757840124 |
1Mb/14P |
0.80mm (.031) Pitch, iPass??I/O SMT Receptacle, Vertical, Internal Application, 36 Circuit, 0.76關m (30關) Gold (Au), SMT Shell, Dual Key |
| 0791077004 |
278Kb/5P |
2.00mm (.079) Pitch Milli-Grid??Receptacle, Vertical, Through Hole, Dual Row, 3.00mm (.118) Tail Length, 0.38關m (15關) Gold (Au) Selective Plating |
| 0791077002 |
278Kb/5P |
2.00mm (.079) Pitch Milli-Grid??Receptacle, Vertical, Through Hole, Dual Row, 3.00mm (.118) Tail Length, 0.38關m (15關) Gold (Au) Selective Plating |
| 0877581050 |
147Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Through Hole, Vertical, 10 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Tray Packaging, Lead-free |
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