| Fabricante Electrónico | No. de pieza | Datasheet | Descripción Electrónicos |
Molex Electronics Ltd.
|
0877582417 |
182Kb/4P |
2.00mm (.079") Pitch Milli-Grid??Header, Through Hole, Vertical, 24 Circuits, 0.76關m(30關") Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free |
| 0791077269 |
278Kb/5P |
2.00mm (.079") Pitch Milli-Grid??Receptacle, Vertical, Through Hole, Dual Row1.91mm (.075") Tail Length, 0.76關m (30關") Gold (Au) Selective Plating, 40 CircuitsLeadfree |
| 0791077260 |
278Kb/5P |
2.00mm (.079") Pitch Milli-Grid??Receptacle, Vertical, Through Hole, Dual Row1.91mm (.075") Tail Length, 0.76關m (30關") Gold (Au) Selective Plating, 22 Circuits, |
| 0753310774 |
343Kb/6P |
1.85mm by 1.85mm (.073 by .073") Pitch 3-Pair GbX짰 Backplane Connector SystemPower Module, 6 Circuits, 1.27關m (50關") Gold (Au), Lead Free |
| 0877159111 |
347Kb/6P |
1.00mm (.039) Pitch, PCI Express* Connector, 64 Circuits, Nylon 4/6 Glass-filled, White Housing, Phosphor Bronze, 0.25關m (10關) Gold (Au) Plating |
| 0877580816 |
182Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Through Hole, Vertical, 8 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free |
| 0872632095 |
367Kb/5P |
2.00mm (.079) Pitch Milli-Grid??Receptacle, Surface Mount, Bottom Entry, 0.76關m (30關) Gold (Au) Selective, 20 Circuits, with Pick-and-Place Cap |
| 0877580616 |
182Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Through Hole, Vertical, 6 Circuits, 0.38關m (15關") Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free |
| 0877159112 |
347Kb/6P |
1.00mm (.039) Pitch, PCI Express* Connector, 64 Circuits, Nylon 4/6 Glass-filled, White Housing, Phosphor Bronze, 0.38關m (15關) Gold (Au) Plating |
| 0877159905 |
295Kb/4P |
1.00mm (.039) Pitch, PCI Express* Connector, 98 Circuits, Nylon 4/6 Glass-filled, Black Housing, Phosphor Bronze, 0.38關m (15關) Gold (Au) Plating |
| 0877583816 |
182Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Through Hole, Vertical, 38 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free |
| 0877582017 |
182Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Through Hole, Vertical, 20 Circuits, 0.76關m (30關) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free |
| 0757830109 |
1Mb/14P |
0.80mm (.031) Pitch, iPass??I/O SMT Receptacle, Right Angle, Internal Application, 36 Circuit, 0.38關m (15關) Gold (Au), Retention Shell, Dual Key |
| 0877159209 |
337Kb/6P |
1.00mm (.039) Pitch, PCI Express* Connector, 98 Circuits, Nylon 4/6 Glass-filled, Black Housing, Phosphor Bronze, 0.76關m (30關) Gold (Au) Plating |
| 0781740800 |
260Kb/6P |
2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, 8 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, with Press-fit Plastic Pegs |
| 0749792504 |
421Kb/4P |
2.00mm (.079) Pitch 6-Row VHDM-HSD??Backplane Header, Open Module, 100 Circuits, Gold (Au) Selective 0.76關m (30關), Pin Length 5.15mm (.203) |
| 0877583017 |
182Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Through Hole, Vertical, 30 Circuits, 0.76關m (30關) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free |
| 0872631893 |
367Kb/5P |
2.00mm (.079) Pitch Milli-Grid??Receptacle, Surface Mount, Bottom Entry, 0.38關m (15關) Gold (Au) Selective, 18 Circuits, with Pick-and-Place Cap |
| 0877582817 |
182Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Through Hole, Vertical, 28 Circuits, 0.76關m (30關) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free |
| 0749791006 |
421Kb/4P |
2.00mm (.079) Pitch 6-Row VHDM-HSD??Backplane Header, Open Module, 40 Circuits, Gold (Au) Selective 1.27關m (50關), Pin Length 4.75mm (.187) |
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