| Fabricante Electrónico | No. de pieza | Datasheet | Descripción Electrónicos |
Molex Electronics Ltd.
|
0877581416 |
182Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Through Hole, Vertical, 14 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free |
| 0877581216 |
182Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Through Hole, Vertical, 12 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free |
| 0757830108 |
1Mb/14P |
0.80mm (.031) Pitch, iPass??I/O SMT Receptacle, Right Angle, Internal Application, 36 Circuit, 0.38關m (15關) Gold (Au), Retention Shell, Right Key |
| 0877581617 |
182Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Through Hole, Vertical, 16 Circuits, 0.76關m (30關) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free |
| 0780790011 |
820Kb/10P |
1.00mm (.039) Pitch DDR3 DIMM Socket, Vertical, Through Hole, with Beveled Metal Pins, Black Housing and Latches, 0.76關m (30關) Gold (Au) Plating |
| 0873815000 |
327Kb/6P |
2.00mm (.079") Pitch Milli-Grid??Receptacle, Surface Mount, Top Entry, 0.38關m (15關") Gold (Au) Plating, with Cap, without Locating Peg, 50 Circuits |
| 0877159306 |
628Kb/10P |
1.00mm (.039") Pitch, PCI Express* Connector, 164 Circuits, Nylon 4/6 Glass-filled, Black Housing, Phosphor Bronze, 0.76關m (30關") Gold (Au) Plating |
| 0749791002 |
421Kb/4P |
2.00mm (.079") Pitch 6-Row VHDM-HSD??Backplane Header, Open Module, 40 Circuits, Gold (Au) Selective 0.76關m (30關"), Pin Length 6.25mm (.246") |
| 0791081061 |
304Kb/6P |
2.00mm (.079") Pitch Milli-Grid??Flex-to-Board Vertical Receptacle Dual Row Through- Hole, 0.76關m (30關") Gold (Au) Selective Plating, 24 Circuits |
| 0877582217 |
182Kb/4P |
2.00mm (.079") Pitch Milli-Grid??Header, Through Hole, Vertical, 22 Circuits, 0.76關m(30關") Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free |
| 0791077222 |
278Kb/5P |
2.00mm (.079") Pitch Milli-Grid??Receptacle, Vertical, Through Hole, Dual Row1.91mm (.075") Tail Length, 0.38關m (15關") Gold (Au) Selective Plating, 46 CircuitsLeadfree |
| 0757571382 |
177Kb/4P |
3.50mm (.138") Pitch, MX150??Header, Breakaway, Vertical, 16 Circuits, 0.75關m(30關") Select Gold (Au) Plating, 11.20mm (.441") Mating Pin Length, 4.75mm (.187") |
| 0791077062 |
278Kb/5P |
2.00mm (.079") Pitch Milli-Grid??Receptacle, Vertical, Through Hole, Dual Row3.00mm (.118) Tail Length, 0.76關m (30關") Gold (Au) Selective Plating, 26 Circuits, |
| 0791091254 |
1Mb/12P |
2.00mm (.079") Pitch Milli-Grid??Receptacle, Surface Mount, Vertical, Top/Bottomwith Press-fit Plastic Pegs, without Cap, Tube, 0.76關m (30關") Gold (Au) |
| 0757830157 |
1Mb/14P |
0.80mm (.031") Pitch, iPass??I/O SMT Receptacle, Right Angle, Internal Application36 Circuit, 0.76關m (30關") Gold (Au), Through Hole Shell, Left Key |
| 0877583216 |
182Kb/4P |
2.00mm (.079") Pitch Milli-Grid??Header, Through Hole, Vertical, 32 Circuits, 0.38關m(15關") Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free |
| 0783950001 |
328Kb/6P |
0.80mm(.031), 1.27mm(.050) Micro SAS Receptacle, Right Angle, SMT, 0.76關m (30關) Gold (Au) Plating, 25 Circuits, for 1.00mm (.039) PCB Thickness |
| 0877585017 |
182Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Through Hole, Vertical, 50 Circuits, 0.76關m (30關) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free |
| 0780790012 |
820Kb/10P |
1.00mm (.039) Pitch DDR3 DIMM Socket, Vertical, Through Hole, with Beveled Metal Pins, Black Housing and Latches, 0.76關m (30關) Gold (Au) Plating |
| 0877156312 |
348Kb/6P |
1.00mm (.039) Pitch, PCI Express* Connector, 164 Circuits, Nylon 6/6 Glass-filled, White Housing, Phosphor Bronze, 0.38關m (15關) Gold (Au) Plating |
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