| Fabricante Electrónico | No. de pieza | Datasheet | Descripción Electrónicos |
Molex Electronics Ltd.
|
0780610002 |
373Kb/7P |
1.00mm (.039) Pitch Fully Buffered DIMM Socket, Vertical, Through Hole, 0.38關m (15關) Gold(Au) Selective Plating, 240 Circuits, with Beveled Metal Pins |
| 0791077330 |
278Kb/5P |
2.00mm (.079") Pitch Milli-Grid??Receptacle, Vertical, Through Hole, Dual Row, 1.91mm (.075") Tail Length, 0.05關m (2關") Gold (Au) Selective Plating, 12 Circuits |
| 0791077013 |
278Kb/5P |
2.00mm (.079") Pitch Milli-Grid??Receptacle, Vertical, Through Hole, Dual Row, 3.00mm (.118) Tail Length, 0.38關m (15關") Gold (Au) Selective Plating, 28 Circuits |
| 0757830131 |
1Mb/14P |
0.80mm (.031") Pitch, iPass??I/O SMT Receptacle, Right Angle, Internal Application, 36 Circuit, 0.38關m (15關") Gold (Au), Through Hole Shell, Dual Key |
| 0757830135 |
1Mb/14P |
0.80mm (.031") Pitch, iPass??I/O SMT Receptacle, Right Angle, Internal Application, 36 Circuit, 0.76關m (30關") Gold (Au), Through Hole Shell, Dual Key |
| 0756490504 |
224Kb/3P |
1.85mm by 1.85mm (.073" by .073") Pitch 3-Pair GbX짰 Backplane L-Series Connector System, Open Header, 40 Circuits, Gold (Au) 0.76關m (30關") |
| 0791077205 |
278Kb/5P |
2.00mm (.079") Pitch Milli-Grid??Receptacle, Vertical, Through Hole, Dual Row, 1.91mm (.075") Tail Length, 0.38關m (15關") Gold (Au) Selective Plating, 12 Circuits |
| 0791077057 |
278Kb/5P |
2.00mm (.079") Pitch Milli-Grid??Receptacle, Vertical, Through Hole, Dual Row, 3.00mm (.118) Tail Length, 0.76關m (30關") Gold (Au) Selective Plating, 16 Circuits |
| 0791077206 |
278Kb/5P |
2.00mm (.079") Pitch Milli-Grid??Receptacle, Vertical, Through Hole, Dual Row, 1.91mm (.075") Tail Length, 0.38關m (15關") Gold (Au) Selective Plating, 14 Circuits |
| 0873812617 |
126Kb/3P |
2.00mm (.079") Pitch Milli-Grid??Receptacle, Surface Mount, Top Entry, 0.76關m (30關")Gold (Au) Plating, without Cap, with Locating Peg, 26 Circuits, Leadfree |
| 0873812817 |
126Kb/3P |
2.00mm (.079") Pitch Milli-Grid??Receptacle, Surface Mount, Top Entry, 0.76關m (30關")Gold (Au) Plating, without Cap, with Locating Peg, 28 Circuits, Leadfree |
| 0791077127 |
278Kb/5P |
2.00mm (.079") Pitch Milli-Grid??Receptacle, Vertical, Through Hole, Dual Row,3.00mm (.118) Tail Length, 0.05關m (2關") Gold (Au) Selective Plating, 6 CircuitsLeadfree |
| 0791077341 |
278Kb/5P |
2.00mm (.079") Pitch Milli-Grid??Receptacle, Vertical, Through Hole, Dual Row,1.91mm (.075) Tail Length, 0.05關m (2關") Gold (Au) Selective Plating, 34 CircuitsLeadfree |
| 0791077011 |
278Kb/5P |
2.00mm (.079") Pitch Milli-Grid??Receptacle, Vertical, Through Hole, Dual Row,3.00mm (.118) Tail Length, 0.38關m (15關") Gold (Au) Selective Plating, 24 Circuits, |
| 0873812417 |
126Kb/3P |
2.00mm (.079") Pitch Milli-Grid??Receptacle, Surface Mount, Top Entry, 0.76關m (30關")Gold (Au) Plating, without Cap, with Locating Peg, 24 Circuits, Leadfree |
| 0791077058 |
278Kb/5P |
2.00mm (.079") Pitch Milli-Grid??Receptacle, Vertical, Through Hole, Dual Row,3.00mm (.118) Tail Length, 0.76關m (30關") Gold (Au) Selective Plating, 18 CircuitsLeadfree |
| 0873812217 |
126Kb/3P |
2.00mm (.079") Pitch Milli-Grid??Receptacle, Surface Mount, Top Entry, 0.76關m (30關")Gold (Au) Plating, without Cap, with Locating Peg, 22 Circuits, Leadfree |
| 0791091201 |
1Mb/12P |
2.00mm (.079") Pitch Milli-Grid??Receptacle, Surface Mount, Vertical, Top/BottomEntry, with Press-fit Plastic Pegs, without Cap, Tube, 0.38關m (15關") Gold (Au) |
| 0873813017 |
126Kb/3P |
2.00mm (.079") Pitch Milli-Grid??Receptacle, Surface Mount, Top Entry, 0.76關m (30關")Gold (Au) Plating, without Cap, with Locating Peg, 30 Circuits, Leadfree |
| 0873813018 |
126Kb/3P |
2.00mm (.079) Pitch Milli-Grid??Receptacle, Surface Mount, Top Entry, 0.38關m (15關) Gold (Au) Plating, without Cap, with Locating Peg, 30 Circuits, Leadfree |
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