| Fabricante Electrónico | No. de pieza | Datasheet | Descripción Electrónicos |
Molex Electronics Ltd.
|
0791077257 |
278Kb/5P |
2.00mm (.079) Pitch Milli-Grid??Receptacle, Vertical, Through Hole, Dual Row, 1.91mm (.075) Tail Length, 0.76關m (30關) Gold (Au) Selective Plating, 16 Circuits |
| 0754650505 |
254Kb/3P |
1.85mm by 1.85mm (.073 by .073) Pitch 4 Pair GbX짰 Backplane L-Series Connector System, Open Header, 55 Circuits, Gold (Au) 0.76關m (30關) |
| 0850481782 |
144Kb/4P |
2.54mm (.100) Pitch DIN 41612/IEC 603-2 Mixed Layout Connector, Through Hole, Vertical, Female Style M, with 4 additional high current solder contacts, 42 Circuits |
| 0757840149 |
1Mb/14P |
0.80mm (.031) Pitch, iPass??I/O SMT Receptacle, Vertical, Internal Application, 36 Circuit, 0.76關m (30關) Gold (Au), Through Hole 3.18 Shell, Left Key |
| 0791077061 |
278Kb/5P |
2.00mm (.079") Pitch Milli-Grid??Receptacle, Vertical, Through Hole, Dual Row, 3.00mm (.118) Tail Length, 0.76關m (30關") Gold (Au) Selective Plating, 24 Circuits |
| 0791077066 |
278Kb/5P |
2.00mm (.079") Pitch Milli-Grid??Receptacle, Vertical, Through Hole, Dual Row, 3.00mm (.118) Tail Length, 0.76關m (30關") Gold (Au) Selective Plating, 34 Circuits |
| 0757830149 |
1Mb/14P |
0.80mm (.031") Pitch, iPass??I/O SMT Receptacle, Right Angle, Internal Application, 36 Circuit, 0.76關m (30關") Gold (Au), Through Hole Shell, Left Key |
| 0873811800 |
327Kb/6P |
2.00mm (.079") Pitch Milli-Grid??Receptacle, Surface Mount, Top Entry, 4.50mm (.177") Height, 0.38關m (15關") Gold (Au) Plating, with Cap,without Locating Peg |
| 0791077332 |
278Kb/5P |
2.00mm (.079") Pitch Milli-Grid??Receptacle, Vertical, Through Hole, Dual Row, 1.91mm (.075) Tail Length, 0.05關m (2關") Gold (Au) Selective Plating, 16 Circuits |
| 0791081065 |
304Kb/6P |
2.00mm (.079") Pitch Milli-Grid??Flex-to-Board Vertical Receptacle Dual Row Through-Hole, 0.76關m (30關") Gold (Au) Selective Plating, 32 Circuits, Leadfree |
| 0873811418 |
125Kb/3P |
2.00mm (.079") Pitch Milli-Grid??Receptacle, Surface Mount, Top Entry, 0.38關m (15關")Gold (Au) Plating, without Cap, with Locating Peg, 14 Circuits, Leadfree |
| 0791077263 |
278Kb/5P |
2.00mm (.079") Pitch Milli-Grid??Receptacle, Vertical, Through Hole, Dual Row1.91mm (.075") Tail Length, 0.76關m (30關") Gold (Au) Selective Plating, 28 Circuits,Leadfree |
| 0791077210 |
278Kb/5P |
2.00mm (.079") Pitch Milli-Grid??Receptacle, Vertical, Through Hole, Dual Row,1.91mm (.075") Tail Length, 0.38關m (15關") Gold (Au) Selective Plating, 22 Circuits, |
| 0791081053 |
304Kb/6P |
2.00mm (.079") Pitch Milli-Grid??Flex-to-Board Vertical Receptacle Dual Row Through-Hole, 0.76關m (30關") Gold (Au) Selective Plating, 8 Circuits, Leadfree |
| 0791091219 |
1Mb/12P |
2.00mm (.079") Pitch Milli-Grid??Receptacle, Surface Mount, Vertical, Top/BottomEntry, with Press-fit Plastic Pegs, without Cap, Tube, 0.38關m (15關") Gold (Au) |
| 0791091005 |
1Mb/12P |
2.00mm (.079") Pitch Milli-Grid??Receptacle, Surface Mount, Vertical, Top/BottomEntry, without Press-fit Plastic Pegs, without Cap, Tube, 0.38關m (15關") Gold (Au) |
| 0791091016 |
1Mb/12P |
2.00mm (.079") Pitch Milli-Grid??Receptacle, Surface Mount, Vertical, Top/BottomEntry, without Press-fit Plastic Pegs, without Cap, Tube, 0.38關m (15關") Gold (Au) |
| 0791091023 |
1Mb/12P |
2.00mm (.079") Pitch Milli-Grid??Receptacle, Surface Mount, Vertical, Top/BottomEntry, without Press-fit Plastic Pegs, without Cap, Tube, 0.38關m (15關") Gold (Au) |
| 0756490503 |
221Kb/3P |
1.85mm by 1.85mm (.073 by .073) Pitch 2-Pair GbX짰 Backplane L-Series Connector System, Open Header, 40 Circuits, Gold (Au) 0.76關m (30關) |
| 0791077070 |
278Kb/5P |
2.00mm (.079) Pitch Milli-Grid??Receptacle, Vertical, Through Hole, Dual Row, 3.00mm (.118) Tail Length, 0.76關m (30關) Gold (Au) Selective Plating, 42 Circuits |
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