| Fabricante Electrónico | No. de pieza | Datasheet | Descripción Electrónicos |
Molex Electronics Ltd.
|
0791077204 |
278Kb/5P |
2.00mm (.079) Pitch Milli-Grid??Receptacle, Vertical, Through Hole, Dual Row, 1.91mm (.075) Tail Length, 0.38關m (15關) Gold (Au) Selective Plating, 10 Circuits |
| 0791077258 |
278Kb/5P |
2.00mm (.079) Pitch Milli-Grid??Receptacle, Vertical, Through Hole, Dual Row, 1.91mm (.075) Tail Length, 0.76關m (30關) Gold (Au) Selective Plating, 18 Circuits |
| 0791081067 |
304Kb/6P |
2.00mm (.079) Pitch Milli-Grid??Flex-to-Board Vertical Receptacle Dual Row Through-Hole, 0.76關m (30關) Gold (Au) Selective Plating, 36 Circuits, Leadfree |
| 0757840148 |
1Mb/14P |
0.80mm (.031) Pitch, iPass??I/O SMT Receptacle, Vertical, Internal Application, 36 Circuit, 0.38關m (15關) Gold (Au), Through Hole 3.18 Shell, Universal Key |
| 0791077215 |
278Kb/5P |
2.00mm (.079) Pitch Milli-Grid??Receptacle, Vertical, Through Hole, Dual Row, 1.91mm (.075) Tail Length, 0.38關m (15關) Gold (Au) Selective Plating, 32 Circuits |
| 0757840154 |
1Mb/14P |
0.80mm (.031) Pitch, iPass??I/O SMT Receptacle, Vertical, Internal Application, 36 Circuit,0.38關m (15關) Gold (Au), Through Hole 3.56 Shell, Right Key |
| 0791077051 |
278Kb/5P |
2.00mm (.079) Pitch Milli-Grid??Receptacle, Vertical, Through Hole, Dual Row, 3.00mm (.118) Tail Length, 0.76關m (30關") Gold (Au) Selective Plating, 4 Circuits |
| 0757840152 |
1Mb/14P |
0.80mm (.031) Pitch, iPass??I/O SMT Receptacle, Vertical, Internal Application, 36 Circuit, 0.76關m (30關) Gold (Au), Through Hole 3.18 Shell, Universal Key |
| 0754921055 |
282Kb/6P |
1.85mm by 1.85mm (.073 by .073) Pitch 2-Pair GbX짰 Backplane Connector System, Power Module, 4 Circuits, 1.27關m (50關) Gold (Au), Lead Free |
| 0873813417 |
125Kb/3P |
2.00mm (.079) Pitch Milli-Grid??Receptacle, Surface Mount, Top Entry, 0.76關m (30關) Gold (Au) Plating, without Cap, with Locating Peg, 34 Circuits, Leadfree |
| 0873811617 |
126Kb/3P |
2.00mm (.079) Pitch Milli-Grid??Receptacle, Surface Mount, Top Entry, 0.76關m (30關) Gold (Au) Plating, without Cap, with Locating Peg, 16 Circuits, Leadfree |
| 0791077015 |
278Kb/5P |
2.00mm (.079) Pitch Milli-Grid??Receptacle, Vertical, Through Hole, Dual Row, 3.00mm (.118) Tail Length, 0.38關m (15關) Gold (Au) Selective Plating, 32 Circuits |
| 0780790051 |
820Kb/10P |
1.00mm (.039") Pitch DDR3 DIMM Socket, Vertical, Through Hole, with Beveled Metal Pins, Black Housing, Off-White Latches, 0.38關m (15關") Gold(Au) Plating |
| 0791077008 |
278Kb/5P |
2.00mm (.079") Pitch Milli-Grid??Receptacle, Vertical, Through Hole, Dual Row, 3.00mm (.118) Tail Length, 0.38關m (15關") Gold (Au) Selective Plating, 18 Circuits |
| 0758540105 |
235Kb/3P |
1.85mm by 1.85mm (.073" by .073") Pitch 4-Pair GbX짰 Backplane L-Series Connector System, Open Header, 110 Circuits, Gold (Au) 0.76關m (30關") |
| 0791077208 |
278Kb/5P |
2.00mm (.079") Pitch Milli-Grid??Receptacle, Vertical, Through Hole, Dual Row, 1.91mm (.075") Tail Length, 0.38關m (15關") Gold (Au) Selective Plating, 18 Circuits |
| 0791077069 |
278Kb/5P |
2.00mm (.079") Pitch Milli-Grid??Receptacle, Vertical, Through Hole, Dual Row, 3.00mm (.118) Tail Length, 0.76關m (30關") Gold (Au) Selective Plating, 40 Circuits |
| 0791077209 |
278Kb/5P |
2.00mm (.079") Pitch Milli-Grid??Receptacle, Vertical, Through Hole, Dual Row, 1.91mm (.075") Tail Length, 0.38關m (15關") Gold (Au) Selective Plating, 20 Circuits |
| 0791077074 |
278Kb/5P |
2.00mm (.079") Pitch Milli-Grid??Receptacle, Vertical, Through Hole, Dual Row3.00mm (.118) Tail Length, 0.76關m (30關") Gold (Au) Selective Plating, 50 Circuits,Leadfree |
| 0791081019 |
304Kb/6P |
2.00mm (.079") Pitch Milli-Grid??Flex-to-Board Vertical Receptacle Dual Row Through-Hole, 0.38關m (15關") Gold (Au) Selective Plating, 40 Circuits, Leadfree |
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