| Fabricante Electrónico | No. de pieza | Datasheet | Descripción Electrónicos |
Molex Electronics Ltd.
|
0791091266 |
1Mb/12P |
2.00mm (.079") Pitch Milli-Grid??Receptacle, Surface Mount, Vertical, Top/BottomEntry, with Press-fit Plastic Pegs, without Cap, Tube, 0.76關m (30關") Gold (Au) |
| 0791081007 |
304Kb/6P |
2.00mm (.079") Pitch Milli-Grid??Flex-to-Board Vertical Receptacle Dual Row Through-Hole, 0.38關m (15關") Gold (Au) Selective Plating, 16 Circuits, Leadfree |
| 0757830148 |
1Mb/14P |
0.80mm (.031) Pitch, iPass??I/O SMT Receptacle, Right Angle, Internal Application, 36 Circuit, 0.38關m (15關) Gold (Au), Through Hole Shell, Universal Key |
| 0753413355 |
516Kb/10P |
1.85mm by 1.85mm (.073 by .073) Pitch 4-Pair GbX짰 Backplane Connector System, Power Module, 12 Circuits, 1.27關m (50關) Gold (Au), Lead Free |
| 0758610104 |
166Kb/3P |
1.85mm by 1.85mm (.073 by .073) Pitch 2-Pair GbX짰 Backplane L-Series Connector System, Open Header, 55 Circuits, Gold (Au) 0.76關m (30關) |
| 0873400613 |
276Kb/5P |
2.00mm (.079) Pitch Milli-Grid??Receptacle, Surface Mount (Very Low Profile), Top Entry, without Locating Peg, 0.76關m (30關) Gold (Au) Plating, 6 Circuits |
| 0753413223 |
317Kb/6P |
1.85mm by 1.85mm (.073 by .073) Pitch 4-Pair GbX짰 Backplane Connector System, Power Module, 12 Circuits, 1.27關m (50關) Gold (Au), Lead Free |
| 0873811017 |
124Kb/3P |
2.00mm (.079) Pitch Milli-Grid??Receptacle, Surface Mount, Top Entry, 0.76關m (30關) Gold (Au) Plating, without Cap, with Locating Peg, 10 Circuits, Leadfree |
| 0791077065 |
278Kb/5P |
2.00mm (.079) Pitch Milli-Grid??Receptacle, Vertical, Through Hole, Dual Row, 3.00mm (.118) Tail Length, 0.76關m (30關) Gold (Au) Selective Plating, 32 Circuits |
| 0872036044 |
122Kb/2P |
D-Subminiature Shielded I/O PCB Male Plug, Right Angle, Through Hole, 9 Circuits, M2.6 Inner Thread Screws Assembled, Gold (Au) 0.76關m (30關) |
| 0791077063 |
278Kb/5P |
2.00mm (.079) Pitch Milli-Grid??Receptacle, Vertical, Through Hole, Dual Row, 3.00mm (.118) Tail Length, 0.76關m (30關) Gold (Au) Selective Plating, 28 Circuits |
| 0791081009 |
304Kb/6P |
2.00mm (.079) Pitch Milli-Grid??Flex-to-Board Vertical Receptacle Dual Row Through-Hole, 0.38關m (15關) Gold (Au) Selective Plating, 20 Circuits, Leadfree |
| 0754921033 |
282Kb/6P |
1.85mm by 1.85mm (.073 by .073) Pitch 2-Pair GbX짰 Backplane Connector System, Power Module, 4 Circuits, 1.27關m (50關) Gold (Au), Lead Free |
| 0780790052 |
820Kb/10P |
1.00mm (.039) Pitch DDR3 DIMM Socket, Vertical, Through Hole, with Beveled Metal Pins, Black Housing, Off-White Latches, 0.38關m (15關) Gold(Au) Plating |
| 0850010074 |
113Kb/4P |
2.54mm (.100) Pitch DIN 41612 Header, Style B/2, Right Angle, Through Hole, 0.6關m (24關) Selective Gold (Au), Fixing Clip available ,32 Circuits |
| 0873812218 |
126Kb/3P |
2.00mm (.079) Pitch Milli-Grid??Receptacle, Surface Mount, Top Entry, 0.38關m (15關) Gold (Au) Plating, without Cap, with Locating Peg, 22 Circuits, Leadfree |
| 0753423223 |
319Kb/6P |
1.85mm by 1.85mm (.073 by .073) Pitch 4-Pair GbX짰 Backplane Connector System, Power Module, 16 Circuits, 1.27關m (50關) Gold (Au), Lead Free |
| 0757830158 |
1Mb/14P |
0.80mm (.031) Pitch, iPass??I/O SMT Receptacle, Right Angle, Internal Application, 36 Circuit, 0.76關m (30關) Gold (Au), Through Hole Shell, Right Key |
| 0791077216 |
278Kb/5P |
2.00mm (.079) Pitch Milli-Grid??Receptacle, Vertical, Through Hole, Dual Row, 1.91mm (.075) Tail Length, 0.38關m (15關) Gold (Au) Selective Plating, 34 Circuits |
| 0757840142 |
1Mb/14P |
0.80mm (.031) Pitch, iPass??I/O SMT Receptacle, Vertical, Internal Application, 36 Circuit, 0.76關m (30關) Gold (Au), Through Hole 2.79 Shell, Right Key |
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