| Fabricante Electrónico | No. de pieza | Datasheet | Descripción Electrónicos |
Molex Electronics Ltd.
|
0757830133 |
1Mb/14P |
0.80mm (.031) Pitch, iPass??I/O SMT Receptacle, Right Angle, Internal Application, 36 Circuit, 0.76關m (30關) Gold (Au), Through Hole Shell, Left Key |
| 0791077059 |
278Kb/5P |
2.00mm (.079) Pitch Milli-Grid??Receptacle, Vertical, Through Hole, Dual Row, 3.00mm (.118) Tail Length, 0.76關m (30關) Gold (Au) Selective Plating, 20 Circuits |
| 0873810817 |
126Kb/3P |
2.00mm (.079) Pitch Milli-Grid??Receptacle, Surface Mount, Top Entry, 0.76關m (30關) Gold (Au) Plating, without Cap, with Locating Peg, 8 Circuits, Leadfree |
| 0791077267 |
278Kb/5P |
2.00mm (.079) Pitch Milli-Grid??Receptacle, Vertical, Through Hole, Dual Row, 1.91mm (.075) Tail Length, 0.76關m (30關) Gold (Au) Selective Plating, 36 Circuits |
| 0791077060 |
278Kb/5P |
2.00mm (.079) Pitch Milli-Grid??Receptacle, Vertical, Through Hole, Dual Row, 3.00mm (.118) Tail Length, 0.76關m (30關) Gold (Au) Selective Plating, 22 Circuits |
| 0791077254 |
278Kb/5P |
2.00mm (.079) Pitch Milli-Grid??Receptacle, Vertical, Through Hole, Dual Row, 1.91mm (.075) Tail Length, 0.76關m (30關) Gold (Au) Selective Plating, 10 Circuits |
| 0757575121 |
177Kb/4P |
3.50mm (.138) Pitch, MX150??Header, Breakaway, Vertical, 4 Circuits, 2.50關m (100關) Tin (Sn) Plating, 16.09mm (.633) Mating Pin Length, 3.05mm (.120) PC Tail |
| 0791077220 |
278Kb/5P |
2.00mm (.079) Pitch Milli-Grid??Receptacle, Vertical, Through Hole, Dual Row, 1.91mm (.075) Tail Length, 0.38關m (15關) Gold (Au) Selective Plating, 42 Circuits |
| 0873813218 |
125Kb/3P |
2.00mm (.079) Pitch Milli-Grid??Receptacle, Surface Mount, Top Entry, 0.38關m (15關) Gold (Au) Plating, without Cap, with Locating Peg, 32 Circuits, Leadfree |
| 0754650504 |
244Kb/3P |
1.85mm by 1.85mm (.073 by .073) Pitch 4 Pair GbX짰 Backplane L-Series Connector System, Open Header, 55 Circuits, Gold (Au) 0.76關m (30關) |
| 0873402014 |
276Kb/5P |
2.00mm (.079") Pitch Milli-Grid??Receptacle, Surface Mount (Very Low Profile), Top Entry, without Locating Peg, 0.38關m (15關") Gold (Au) Plating, 20 Circuits |
| 0791077201 |
278Kb/5P |
2.00mm (.079") Pitch Milli-Grid??Receptacle, Vertical, Through Hole, Dual Row, 1.91mm (.075") Tail Length, 0.38關m (15關") Gold (Au) Selective Plating, 4 Circuits |
| 0783210012 |
719Kb/9P |
1.00mm (.039") Pitch DDR3 DIMM Socket, LLCR, Vertical, Through Hole, with Beveled Metal Pins, Black Housing and Latches, 0.76關m (30關") Gold (Au) Plating |
| 0791077003 |
278Kb/5P |
2.00mm (.079") Pitch Milli-Grid??Receptacle, Vertical, Through Hole, Dual Row, 3.00mm (.118) Tail Length, 0.38關m (15關") Gold (Au) Selective Plating, 8 Circuits |
| 0791081052 |
304Kb/6P |
2.00mm (.079") Pitch Milli-Grid??Flex-to-Board Vertical Receptacle Dual Row Through- Hole, 0.76關m (30關") Gold (Au) Selective Plating, 6 Circuits, Leadfree |
| 0754921023 |
282Kb/6P |
1.85mm by 1.85mm (.073 by .073") Pitch 2-Pair GbX짰 Backplane Connector System, Power Module, 4 Circuits, 1.27關m (50關") Gold (Au), Lead Free |
| 0791077203 |
278Kb/5P |
2.00mm (.079") Pitch Milli-Grid??Receptacle, Vertical, Through Hole, Dual Row, 1.91mm (.075") Tail Length, 0.38關m (15關") Gold (Au) Selective Plating, 8 Circuits |
| 0873402013 |
276Kb/5P |
2.00mm (.079") Pitch Milli-Grid??Receptacle, Surface Mount (Very Low Profile), Top Entry, without Locating Peg, 0.76關m (30關") Gold (Au) Plating, 20 Circuits |
| 0791077217 |
278Kb/5P |
2.00mm (.079") Pitch Milli-Grid??Receptacle, Vertical, Through Hole, Dual Row, 1.91mm (.075") Tail Length, 0.38關m (15關") Gold (Au) Selective Plating, 36 Circuits |
| 0791091021 |
1Mb/12P |
2.00mm (.079") Pitch Milli-Grid??Receptacle, Surface Mount, Vertical, Top/BottomEntry, without Press-fit Plastic Pegs, without Cap, Tube, 0.38關m (15關") Gold (Au) |
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