| Fabricante Electrónico | No. de pieza | Datasheet | Descripción Electrónicos |
Molex Electronics Ltd.
|
0753310555 |
341Kb/6P |
1.85mm by 1.85mm (.073 by .073") Pitch 3-Pair GbX짰 Backplane Connector System,Power Module, 6 Circuits, 1.27關m (50關") Gold (Au), Lead Free |
| 0791081069 |
304Kb/6P |
2.00mm (.079") Pitch Milli-Grid??Flex-to-Board Vertical Receptacle Dual Row Through-Hole, 0.76關m (30關") Gold (Au) Selective Plating, 40 Circuits, Leadfree |
| 0873813418 |
126Kb/3P |
2.00mm (.079") Pitch Milli-Grid??Receptacle, Surface Mount, Top Entry, 0.38關m (15關")Gold (Au) Plating, without Cap, with Locating Peg, 34 Circuits, Leadfree |
| 0877468001 |
520Kb/8P |
1.00mm (.039") Pitch DDR-II DIMM Socket, Vertical, Press-fit, 1.8V Center Keys4.20mm (.165") Tail Length, Beige Latches, 240 Circuits, 0.38關m(15關") Selective |
| 0757575141 |
177Kb/4P |
3.50mm (.138") Pitch, MX150??Header, Breakaway, Vertical, 8 Circuits, 2.50關m(100關") Tin (Sn) Plating, 16.09mm (.633") Mating Pin Length, 3.05mm (.120") PC Tail |
| 0757576181 |
177Kb/4P |
3.50mm (.138") Pitch, MX150??Header, Breakaway, Vertical, 16 Circuits, 2.5關m(100關") Tin (Sn) Plating, 27.77mm (1.093") Mating Pin Length, 3.05mm (.120") PC Tail |
| 0791077211 |
278Kb/5P |
2.00mm (.079) Pitch Milli-Grid??Receptacle, Vertical, Through Hole, Dual Row, 1.91mm (.075) Tail Length, 0.38關m (15關) Gold (Au) Selective Plating, 24 Circuits |
| 0791081014 |
304Kb/6P |
2.00mm (.079) Pitch Milli-Grid??Flex-to-Board Vertical Receptacle Dual Row Through-Hole, 0.38關m (15關) Gold (Au) Selective Plating, 30 Circuits, Leadfree |
| 0791081004 |
304Kb/6P |
2.00mm (.079) Pitch Milli-Grid??Flex-to-Board Vertical Receptacle Dual Row Through-Hole, 0.38關m (15關) Gold (Au) Selective Plating, 10 Circuits, Leadfree |
| 0753310533 |
341Kb/6P |
1.85mm by 1.85mm (.073 by .073) Pitch 3-Pair GbX짰 Backplane Connector System, Power Module, 6 Circuits, 1.27關m (50關) Gold (Au), Lead Free |
| 0873811217 |
126Kb/3P |
2.00mm (.079) Pitch Milli-Grid??Receptacle, Surface Mount, Top Entry, 0.76關m (30關) Gold (Au) Plating, without Cap, with Locating Peg, 12 Circuits, Leadfree |
| 0757830154 |
1Mb/14P |
0.80mm (.031) Pitch, iPass??I/O SMT Receptacle, Right Angle, Internal Application, 36 Circuit, 0.38關m (15關) Gold (Au), Through Hole Shell, Right Key |
| 0757830130 |
1Mb/14P |
0.80mm (.031) Pitch, iPass??I/O SMT Receptacle, Right Angle, Internal Application, 36 Circuit, 0.38關m (15關) Gold (Au), Through Hole Shell, Right Key |
| 0791081015 |
304Kb/6P |
2.00mm (.079) Pitch Milli-Grid??Flex-to-Board Vertical Receptacle Dual Row Through-Hole, 0.38關m (15關) Gold (Au) Selective Plating, 32 Circuits, Leadfree |
| 0873819030 |
112Kb/3P |
2.00mm (.079) Pitch Milli-Grid??Receptacle, Surface Mount, Top Entry, 0.76關m (30關) Gold (Au) Plating, with Cap Version, with Locating Pegs, 10 Circuits |
| 0791077014 |
278Kb/5P |
2.00mm (.079) Pitch Milli-Grid??Receptacle, Vertical, Through Hole, Dual Row, 3.00mm (.118) Tail Length, 0.38關m (15關) Gold (Au) Selective Plating, 30 Circuits |
| 0791081002 |
304Kb/6P |
2.00mm (.079) Pitch Milli-Grid??Flex-to-Board Vertical Receptacle Dual Row Through-Hole, 0.38關m (15關) Gold (Au) Selective Plating, 6 Circuits, Leadfree |
| 0754650104 |
244Kb/3P |
1.85mm by 1.85mm (.073 by .073) Pitch 4 Pair GbX짰 Backplane L-Series Connector System, Open Header, 110 Circuits, Gold (Au) 0.76關m (30關) |
| 0757840137 |
1Mb/14P |
0.80mm (.031) Pitch, iPass??I/O SMT Receptacle, Vertical, Internal Application, 36 Circuit, 0.38關m (15關) Gold (Au), Through Hole 2.79 Shell, Left Key |
| 0873810618 |
124Kb/3P |
2.00mm (.079) Pitch Milli-Grid??Receptacle, Surface Mount, Top Entry, 0.38關m (15關) Gold (Au) Plating, without Cap, with Locating Peg, 6 Circuits, Leadfree |
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