| Fabricante Electrónico | No. de pieza | Datasheet | Descripción Electrónicos |

Molex Electronics Ltd.
|
0791077218 |
278Kb/5P |
2.00mm (.079) Pitch Milli-Grid??Receptacle, Vertical, Through Hole, Dual Row, 1.91mm (.075) Tail Length, 0.38關m (15關) Gold (Au) Selective Plating, 38 Circuits |
| 0791077207 |
278Kb/5P |
2.00mm (.079") Pitch Milli-Grid??Receptacle, Vertical, Through Hole, Dual Row, 1.91mm (.075) Tail Length, 0.38關m (15關) Gold (Au) Selective Plating, 16 Circuits |
| 0783150001 |
526Kb/8P |
1.00mm (.039) Pitch DDR3 DIMM Socket, Very Low Profile, Vertical, Press-Fit, with Pegs, Black Housing and Latches, 0.76關m (30關) Gold (Au)Plating |
| 0791081012 |
304Kb/6P |
2.00mm (.079) Pitch Milli-Grid??Flex-to-Board Vertical Receptacle Dual Row Through-Hole, 0.38關m (15關) Gold (Au) Selective Plating, 26 Circuits, Leadfree |
| 0757830145 |
1Mb/14P |
0.80mm (.031) Pitch, iPass??I/O SMT Receptacle, Right Angle, Internal Application, 36 Circuit, 0.38關m (15關) Gold (Au), Through Hole Shell, Left Key |
| 0753412522 |
317Kb/6P |
1.85mm by 1.85mm (.073 by .073) Pitch 4-Pair GbX짰 Backplane Connector System, Power Module, 12 Circuits, 1.27關m (50關) Gold (Au), Lead Free |
| 0791077130 |
278Kb/5P |
2.00mm (.079) Pitch Milli-Grid??Receptacle, Vertical, Through Hole, Dual Row, 3.00mm (.118) Tail Length, 0.05關m (2關) Gold (Au) Selective Plating, 12 Circuits |
| 0875520807 |
284Kb/5P |
1.27mm (.050) Pitch EBBI??50D Receptacle, Through Hole, Right Angle, with Beveled Metal Pins, 0.76關m (30關) Gold (Au) Selective Plating, 80 Circuits, Leadfree |
| 0877159322 |
638Kb/10P |
1.00mm (.039) Pitch, PCI Express* Connector, 164 Circuits, Nylon 4/6 Glass-filled, Blue (287U) Housing, Phosphor Bronze, 0.38關m (15關) Gold (Au) Plating |
| 0754921025 |
282Kb/6P |
1.85mm by 1.85mm (.073 by .073) Pitch 2-Pair GbX짰 Backplane Connector System, Power Module, 4 Circuits, 1.27關m (50關) Gold (Au), Lead Free |
| 0791077053 |
278Kb/5P |
2.00mm (.079) Pitch Milli-Grid??Receptacle, Vertical, Through Hole, Dual Row, 3.00mm (.118) Tail Length, 0.76關m (30關) Gold (Au) Selective Plating, 8 Circuits |
| 0791077336 |
278Kb/5P |
2.00mm (.079) Pitch Milli-Grid??Receptacle, Vertical, Through Hole, Dual Row, 1.91mm (.075) Tail Length, 0.05關m (2關) Gold (Au) Selective Plating, 24 Circuits |
| 0757830144 |
1Mb/14P |
0.80mm (.031) Pitch, iPass??I/O SMT Receptacle, Right Angle, Internal Application, 36 Circuit, 0.76關m (30關) Gold (Au), Through Hole Shell, Universal Key |
| 0791077262 |
278Kb/5P |
2.00mm (.079) Pitch Milli-Grid??Receptacle, Vertical, Through Hole, Dual Row, 1.91mm (.075) Tail Length, 0.76關m (30關) Gold (Au) Selective Plating, 26 Circuits |
| 0791077265 |
278Kb/5P |
2.00mm (.079) Pitch Milli-Grid??Receptacle, Vertical, Through Hole, Dual Row, 1.91mm (.075) Tail Length, 0.76關m (30關) Gold (Au) Selective Plating, 32 Circuits |
| 0791077212 |
278Kb/5P |
2.00mm (.079) Pitch Milli-Grid??Receptacle, Vertical, Through Hole, Dual Row, 1.91mm (.075) Tail Length, 0.38關m (15關) Gold (Au) Selective Plating, 26 Circuits |
| 0757830140 |
1Mb/14P |
0.80mm (.031) Pitch, iPass??I/O SMT Receptacle, Right Angle, Internal Application, 36 Circuit, 0.38關m (15關) Gold (Au), Through Hole Shell, Universal Key |
| 0791077067 |
278Kb/5P |
2.00mm (.079) Pitch Milli-Grid??Receptacle, Vertical, Through Hole, Dual Row, 3.00mm (.118) Tail Length, 0.76關m (30關) Gold (Au) Selective Plating, 36 Circuits |
| 0873814683 |
227Kb/5P |
2.00mm (.079") Pitch Milli-Grid??Receptacle, Surface Mount, Top Entry, 0.76關m (30關") Gold (Au) Plating, with Cap, with Locating Pegs, 46 Circuits, Lead-free |
| 0873813864 |
327Kb/6P |
2.00mm (.079") Pitch Milli-Grid??Receptacle, Surface Mount, Top Entry, 0.38關m (15關")Gold (Au) Plating, with Cap, without Locating Pegs, 38 Circuits, Lead-free |