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STM32L552VCU6PXXX Datasheet(PDF) 324 Page - STMicroelectronics |
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STM32L552VCU6PXXX Datasheet(HTML) 324 Page - STMicroelectronics |
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324 / 340 page  Package information STM32L552xx 324/340 DS12737 Rev 6 Figure 92. UFBGA132 recommended footprint Z - 0.750 - - 0.0295 - ddd - 0.080 - - 0.0031 - eee - 0.150 - - 0.0059 - fff - 0.050 - - 0.0020 - 1. Values in inches are converted from mm and rounded to 4 decimal digits. Table 159. UFBGA132 mechanical data (continued) Symbol millimeters inches(1) Min Typ Max Min Typ Max Table 160. UFBGA132 recommended PCB design rules (0.5 mm pitch BGA) Dimension Recommended values Pitch 0.5 mm Dpad 0.280 mm Dsm 0.370 mm typ. (depends on the soldermask reg- istration tolerance) Stencil opening 0.280 mm Stencil thickness Between 0.100 mm and 0.125 mm Pad trace width 0.100 mm Ball diameter 0.280 mm UFBGA132_A0G8_FP_V1 Dpad Dsm |
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