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STM32469VG Datasheet(PDF) 201 Page - STMicroelectronics

No. de pieza STM32469VG
Descripción Electrónicos  Arm® Cortex®-M4 32b MCUFPU, 225DMIPS, up to 2MB Flash/3844KB RAM, USB OTG HS/FS, Ethernet, FMC, dual Quad-SPI, Graphical accelerator, Camera IF, LCD-TFT & MIPI DSI
PDF  220 Pages
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Fabricante Electrónico  STMICROELECTRONICS [STMicroelectronics]
Página de inicio  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STM32469VG Datasheet(HTML) 201 Page - STMicroelectronics

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DS11189 Rev 7
201/220
STM32F469xx
Package information
217
Figure 88. UFBGA169 - Recommended footprint
Note:
Non-solder mask defined (NSMD) pads are recommended.
Note:
4 to 6 mils solder paste screen printing process.
Device marking for UFBGA169
The following figure gives an example of topside marking orientation versus ball A1 identifier
location. Other optional marking or inset/upset marks, which identify the parts throughout
supply chain operations, are not indicated below.
ddd
-
-
0.100
-
-
0.0039
eee
-
-
0.150
-
-
0.0059
fff
-
-
0.050
-
-
0.0020
1. Values in inches are converted from mm and rounded to four decimal digits.
Table 117. UFBGA169 - Recommended PCB design rules (0.5 mm pitch BGA)
Dimension
Recommended values
Pitch
0.5
Dpad
0.27 mm
Dsm
0.35 mm typ. (depends on the soldermask registration tolerance)
Solder paste
0.27 mm aperture diameter.
Table 116. UFBGA169 - Mechanical data (continued)
Symbol
millimeters
inches(1)
Min.
Typ.
Max.
Min.
Typ.
Max.
BGA_WLCSP_FT_V1
Dsm
Dpad



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