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STM32F373VC Datasheet(PDF) 116 Page - STMicroelectronics

No. de pieza STM32F373VC
Descripción Electrónicos  ARM® Cortex®-M4 32b MCUFPU, up to 256KB Flash32KB SRAM, timers, 4 ADCs (16-bit Sig. Delta / 12-bit SAR), 3 DACs, 2 comp., 2.0-3.6 V
PDF  137 Pages
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Fabricante Electrónico  STMICROELECTRONICS [STMicroelectronics]
Página de inicio  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STM32F373VC Datasheet(HTML) 116 Page - STMicroelectronics

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STM32F373xx
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DocID022691 Rev 7
Figure 33. UFBGA100 - 100-pin, 7 x 7 mm, 0.50 mm pitch,
ultra fine pitch ball grid array package recommended footprint
D
6.950
7.000
7.050
0.2736
0.2756
0.2776
D1
5.450
5.500
5.550
0.2146
0.2165
0.2185
E
6.950
7.000
7.050
0.2736
0.2756
0.2776
E1
5.450
5.500
5.550
0.2146
0.2165
0.2185
e
-
0.500
-
-
0.0197
-
F
0.700
0.750
0.800
0.0276
0.0295
0.0315
ddd
-
-
0.100
-
-
0.0039
eee
-
-
0.150
-
-
0.0059
fff
-
-
0.050
-
-
0.0020
1. Values in inches are converted from mm and rounded to 4 decimal digits.
Table 77. UFBGA100 recommended PCB design rules (0.5 mm pitch BGA)
Dimension
Recommended values
Pitch
0.5
Dpad
0.280 mm
Dsm
0.370 mm typ. (depends on the soldermask
registration tolerance)
Stencil opening
0.280 mm
Stencil thickness
Between 0.100 mm and 0.125 mm
Table 76. UFBGA100 - 100-pin, 7 x 7 mm, 0.50 mm pitch, ultra fine pitch ball grid array
package mechanical data (continued)
Symbol
millimeters
inches(1)
Min.
Typ.
Max.
Min.
Typ.
Max.



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