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STM32H745II Datasheet(PDF) 243 Page - STMicroelectronics |
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STM32H745II Datasheet(HTML) 243 Page - STMicroelectronics |
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243 / 252 page ![]() DS12923 Rev 1 243/252 STM32H745xI/G Package information 250 Figure 80. UFBGA176+25 package recommended footprint eee - - 0.150 - - 0.0059 fff - - 0.050 - - 0.0020 1. Values in inches are converted from mm and rounded to 4 decimal digits. Table 133. UFBGA176+25 recommended PCB design rules (0.65 mm pitch BGA) Dimension Recommended values Pitch 0.65 mm Dpad 0.300 mm Dsm 0.400 mm typ. (depends on the soldermask registration tolerance) Stencil opening 0.300 mm Stencil thickness Between 0.100 mm and 0.125 mm Pad trace width 0.100 mm Table 132. UFBGA176+25 package mechanical data (continued) Symbol millimeters inches(1) Min. Typ. Max. Min. Typ. Max. A0E7_FP_V1 Dpad Dsm |
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