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ST25DV64K Datasheet(PDF) 147 Page - STMicroelectronics

No. de pieza ST25DV64K
Descripción Electrónicos  Dynamic NFC/RFID tag IC with 4-, 16-, or 64-Kbit EEPROM, and fast transfer mode capability
PDF  197 Pages
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Fabricante Electrónico  STMICROELECTRONICS [STMicroelectronics]
Página de inicio  http://www.st.com
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ST25DV64K Datasheet(HTML) 147 Page - STMicroelectronics

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Table 255. SO8N – Mechanical data
Symbol
millimeters
inches (1)
Min.
Typ.
Max.
Min.
Typ.
Max.
A
-
-
1.750
-
-
0.0689
A1
0.100
-
0.250
0.0039
-
0.0098
A2
1.250
-
-
0.0492
-
-
b
0.280
-
0.480
0.0110
-
0.0189
c
0.170
-
0.230
0.0067
-
0.0091
D(2)
4.800
4.900
5.000
0.1890
0.1929
0.1969
E
5.800
6.000
6.200
0.2283
0.2362
0.2441
E1(3)
3.800
3.900
4.000
0.1496
0.1535
0.1575
e
-
1.270
-
-
0.0500
-
h
0.250
-
0.500
0.0098
-
0.0197
k
0°
-
8°
0°
-
8°
L
0.400
-
1.270
0.0157
-
0.0500
L1
-
1.040
-
-
0.0409
-
ccc
-
-
0.100
-
-
0.0039
1. Values in inches are converted from mm and rounded to four decimal digits.
2. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusions or gate burrs shall not exceed
0.15 mm per side
3. Dimension “E1” does not include interlead flash or protrusions. Interlead flash or protrusions shall not exceed 0.25 mm per
side.
Note:
The package top may be smaller than the package bottom. Dimensions D and E1 are determinated at the
outermost extremes of the plastic body exclusive of mold flash, tie bar burrs, gate burrs and interleads flash,
but including any mismatch between the top and bottom of plastic body. Measurement side for mold flash,
protusions or gate burrs is bottom side.
Figure 79. SO8N - Footprint example
1.27
0.6 (x8)
1.
Dimensions are expressed in millimeters.
10.2
TSSOP8 package information
This TSSOP is an 8-lead, 3 x 6.4 mm, 0.65 mm pitch, thin shrink small outline package.
ST25DV04K ST25DV16K ST25DV64K
TSSOP8 package information
DS10925 - Rev 11
page 147/197



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