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STM32H563RI Datasheet(PDF) 243 Page - STMicroelectronics |
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STM32H563RI Datasheet(HTML) 243 Page - STMicroelectronics |
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243 / 270 page ![]() DS14258 Rev 5 243/270 STM32H562xx and STM32H563xx Package information 265 6.3 VFQFPN68 package information (B029) This VFQFPN is a 68 pins, 8 x 8 mm, 0.4 mm pitch, very thin fine pitch quad flat package. Figure 81. VFQFPN68 - Outline 1. VFQFPN stands for Thermally Enhanced Very thin Fine pitch Quad Flat Packages No lead. Sawed version. Very thin profile: 0.80 < A ≤ 1.00mm. 2. The pin #1 identifier must be existed on the top surface of the package by using indentation mark or other feature of package body. Exact shape and size of this feature is optional. C D E TOP VIEW PIN 1 IDENTIFIER LASER MARKING 68 67 1 2 (2X) 0.10 C D2 E2 68 67 2 1 PIN 1 ID C 0.30 X 45' e b BOTTOM VIEW L EXPOSED PAD AREA SIDE VIEW E SEATING PLANE ddd C A A1 A2 B029_VFQFPN68_ME_V1 |
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