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STM32L452VCU6P Datasheet(PDF) 197 Page - STMicroelectronics

No. de pieza STM32L452VCU6P
Descripción Electrónicos  Ultra-low-power ARM® Cortex®-M4 32-bit MCUFPU, 100DMIPS, up to 512KB Flash, 160KB SRAM, analog, audio, ext. SMPS
PDF  210 Pages
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Fabricante Electrónico  STMICROELECTRONICS [STMicroelectronics]
Página de inicio  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STM32L452VCU6P Datasheet(HTML) 197 Page - STMicroelectronics

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STM32L452xx
Package information
207
Figure 50. UFBGA64 – 64-ball, 5 x 5 mm, 0.5 mm pitch ultra profile fine pitch ball grid
array
package recommended footprint
Device marking
The following figure gives an example of topside marking orientation versus ball A1 identifier
location.
Other optional marking or inset/upset marks, which identify the parts throughout supply
chain operations, are not indicated below.
F
0.700
0.750
0.800
0.0276
0.0295
0.0315
ddd
-
-
0.080
-
-
0.0031
eee
-
-
0.150
-
-
0.0059
fff
-
-
0.050
-
-
0.0020
1. Values in inches are converted from mm and rounded to 4 decimal digits.
Table 105. UFBGA64 – 64-ball, 5 x 5 mm, 0.5 mm pitch ultra profile fine pitch ball grid array
package mechanical data (continued)
Symbol
millimeters
inches(1)
Min
Typ
Max
Min
Typ
Max
A
0.460
0.530
0.600
0.0181
0.0209
0.0236
Table 106. UFBGA64 recommended PCB design rules (0.5 mm pitch BGA)
Dimension
Recommended values
Pitch
0.5
Dpad
0.280 mm
Dsm
0.370 mm typ. (depends on the soldermask
registration tolerance)
Stencil opening
0.280 mm
Stencil thickness
Between 0.100 mm and 0.125 mm
Pad trace width
0.100 mm



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