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STM32L443VCU6 Datasheet(PDF) 190 Page - STMicroelectronics

No. de pieza STM32L443VCU6
Descripción Electrónicos  Ultra-low-power Arm® Cortex®-M4 32-bit MCUFPU, 100DMIPS, 256KB Flash, 64KB SRAM, USB FS, LCD, analog, audio, AES
PDF  215 Pages
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Fabricante Electrónico  STMICROELECTRONICS [STMicroelectronics]
Página de inicio  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STM32L443VCU6 Datasheet(HTML) 190 Page - STMicroelectronics

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Package information
STM32L443CC STM32L443RC STM32L443VC
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DS11421 Rev 4
Figure 46. UFBGA100 - 100-ball, 7 x 7 mm, 0.50 mm pitch, ultra fine pitch ball grid
array package recommended footprint
Device marking
The following figure gives an example of topside marking orientation versus ball A1 identifier
location.
Other optional marking or inset/upset marks, which identify the parts throughout supply
chain operations, are not indicated below.
ddd
-
-
0.080
-
-
0.0031
eee
-
-
0.150
-
-
0.0059
fff
-
-
0.050
-
-
0.0020
1. Values in inches are converted from mm and rounded to 4 decimal digits.
Table 94. UFBGA100 recommended PCB design rules (0.5 mm pitch BGA)
Dimension
Recommended values
Pitch
0.5
Dpad
0.280 mm
Dsm
0.370 mm typ. (depends on the solder mask
registration tolerance)
Stencil opening
0.280 mm
Stencil thickness
Between 0.100 mm and 0.125 mm
Table 93. UFBGA100 - 100-ball, 7 x 7 mm, 0.50 mm pitch, ultra fine pitch ball grid
array package mechanical data (continued)
Symbol
millimeters
inches(1)
Min.
Typ.
Max.
Min.
Typ.
Max.



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