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STM32L443VCU6 Datasheet(PDF) 198 Page - STMicroelectronics

No. de pieza STM32L443VCU6
Descripción Electrónicos  Ultra-low-power Arm® Cortex®-M4 32-bit MCUFPU, 100DMIPS, 256KB Flash, 64KB SRAM, USB FS, LCD, analog, audio, AES
PDF  215 Pages
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Fabricante Electrónico  STMICROELECTRONICS [STMicroelectronics]
Página de inicio  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STM32L443VCU6 Datasheet(HTML) 198 Page - STMicroelectronics

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Package information
STM32L443CC STM32L443RC STM32L443VC
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DS11421 Rev 4
Figure 55. WLCSP64 - 64-ball, 3.141 x 3.127 mm, 0.35 mm pitch wafer level chip scale
package recommended footprint
b(3)
0.190
0.220
0.250
0.0075
0.0087
0.0098
D
3.106
3.141
3.176
0.1223
0.1237
0.1250
E
3.092
3.127
3.162
0.1217
0.1231
0.1245
e
-
0.350
-
-
0.0138
-
e1
-
2.450
-
-
0.0965
-
e2
-
2.450
-
-
0.0965
-
F
-
0.3455
-
-
0.0136
-
G
-
0.3385
-
-
0.0133
-
aaa
-
-
0.100
-
-
0.0039
bbb
-
-
0.100
-
-
0.0039
ccc
-
-
0.100
-
-
0.0039
ddd
-
-
0.050
-
-
0.0020
eee
-
-
0.050
-
-
0.0020
1. Values in inches are converted from mm and rounded to 4 decimal digits.
2. Back side coating.
3. Dimension is measured at the maximum bump diameter parallel to primary datum Z.
Table 99. WLCSP64 recommended PCB design rules (0.35 mm pitch)
Dimension
Recommended values
Pitch
0.35 mm
Dpad
0.210 mm
Dsm
0.275 mm typ. (depends on the soldermask
registration tolerance)
Stencil opening
0.235 mm
Stencil thickness
0.100 mm
Table 98. WLCSP64 - 64-ball, 3.141 x 3.127 mm, 0.35 mm pitch wafer level chip scale
package mechanical data (continued)
Symbol
millimeters
inches(1)
Min
Typ
Max
Min
Typ
Max



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