3

8021DS–AVR–06/08

ATmega329P/3290P

Figure 1-2.

Pinout ATmega329P

Note:

The large center pad underneath the QFN/MLF packages is made of metal and internally con-

nected to GND. It should be soldered or glued to the board to ensure good mechanical stability. If

the center pad is left unconnected, the package might loosen from the board.

1.1

Disclaimer

Typical values contained in this datasheet are based on simulations and characterization of

other AVR microcontrollers manufactured on the same process technology. Min and Max values

will be available after the device is characterized.

PC0 (SEG12)

(RXD/PCINT0) PE0

(TXD/PCINT1) PE1

LCDCAP

(XCK/AIN0/PCINT2) PE2

(AIN1/PCINT3) PE3

(USCK/SCL/PCINT4) PE4

(DI/SDA/PCINT5) PE5

(DO/PCINT6) PE6

(CLKO/PCINT7) PE7

(SCK/PCINT9) PB1

(MOSI/PCINT10) PB2

(MISO/PCINT11) PB3

(OC0A/PCINT12) PB4

(OC1B/PCINT14) PB6

(OC1A/PCINT13) PB5

PC1 (SEG11)

PG0 (SEG14)

PC2 (SEG10)

PC3 (SEG9)

PC4 (SEG8)

PC5 (SEG7)

PC6 (SEG6)

PC7 (SEG5)

PA7 (SEG3)

PG2 (SEG4)

PA6 (SEG2)

PA5 (SEG1)

PA4 (SEG0)

PA3 (COM3)

PG1 (SEG13)

INDEX CORNER

(SS/PCINT8) PB0

2

3

1

4

5

6

7

8

9

10

11

12

13

14

16

15

47

46

48

45

44

43

42

41

40

39

38

37

36

35

33

34

ATmega329