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STM8L15 Datasheet(PDF) 115 Page - STMicroelectronics

No. de pieza STM8L15
Descripción Electrónicos  8-bit ultralow power MCU, up to 32 KB Flash, 1 KB Data EEPROM RTC, LCD, timers, USART, I2C, SPI, ADC, DAC, comparators
PDF  122 Pages
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Fabricante Electrónico  STMICROELECTRONICS [STMicroelectronics]
Página de inicio  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STM8L15 Datasheet(HTML) 115 Page - STMicroelectronics

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STM8L151xx, STM8L152xx
Package characteristics
Doc ID 15962 Rev 5
115/122
Figure 45.
UFQFPN32 - 32-lead ultra thin fine pitch
quad flat no-lead package outline
(5x5)(1)(2)(3)
Figure 46.
UFQFPN32 recommended
footprint(1)(4)
1.
Drawing is not to scale.
2.
All leads/pads should also be soldered to the PCB to improve the lead/pad solder joint life.
3.
There is an exposed die pad on the underside of the UFQFPN package. It is recommended to connect and solder this back-
side pad to PCB ground.
4.
Dimensions are in millimeters.
Seating plane
ddd
C
C
A3
A1
A
D
e
9
16
17
24
32
Pin # 1 ID
R = 0.30
8
E
L
L
D2
1
b
E2
A0B8_ME
Bottom view
Table 62.
UFQFPN32 - 32-lead ultra thin fine pitch quad flat no-lead package (5 x 5),
package mechanical data
Dim.
mm
inches(1)
Min
Typ
Max
Min
Typ
Max
A
0.5
0.55
0.6
0.0197
0.0217
0.0236
A1
0.00
0.02
0.05
0
0.0008
0.0020
A3
0.152
0.006
b
0.18
0.23
0.28
0.0071
0.0091
0.0110
D
4.90
5.00
5.10
0.1929
0.1969
0.2008
D2
3.50
0.1378
E
4.90
5.00
5.10
0.1929
0.1969
0.2008
E2
3.40
3.50
3.60
0.1339
0.1378
0.1417
e
0.500
0.0197
L
0.30
0.40
0.50
0.0118
0.0157
0.0197
ddd
0.08
0.0031
Number of pins
N32
1.
Values in inches are converted from mm and rounded to 4 decimal digits.



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