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STM32F401CB Datasheet(PDF) 129 Page - STMicroelectronics

No. de pieza STM32F401CB
Descripción Electrónicos  Up to 81 I/O ports with interrupt capability
PDF  134 Pages
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Fabricante Electrónico  STMICROELECTRONICS [STMicroelectronics]
Página de inicio  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STM32F401CB Datasheet(HTML) 129 Page - STMicroelectronics

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STM32F401xB STM32F401xC
Package information
130
7.6
Thermal characteristics
The maximum chip junction temperature (TJmax) must never exceed the values given in
Table 14: General operating conditions on page 59.
The maximum chip-junction temperature, TJ max., in degrees Celsius, may be calculated
using the following equation:
TJ max = TA max + (PD max x ΘJA)
Where:
TA max is the maximum ambient temperature in °C,
•ΘJA is the package junction-to-ambient thermal resistance, in °C/W,
PD max is the sum of PINT max and PI/O max (PD max = PINT max + PI/Omax),
PINT max is the product of IDD and VDD, expressed in Watts. This is the maximum chip
internal power.
PI/O max represents the maximum power dissipation on output pins where:
PI/O max = Σ (VOL × IOL) + Σ((VDD – VOH) × IOH),
taking into account the actual VOL / IOL and VOH / IOH of the I/Os at low and high level in the
application.
7.6.1
Reference document
JESD51-2 Integrated Circuits Thermal Test Method Environment Conditions - Natural
Convection (Still Air). Available from www.jedec.org.
Table 86. Package thermal characteristics
Symbol
Parameter
Value
Unit
ΘJA
Thermal resistance junction-ambient
UFQFPN48
32
°C/W
Thermal resistance junction-ambient
WLCSP49
52
Thermal resistance junction-ambient
LQFP64
50
Thermal resistance junction-ambient
LQFP100
42
Thermal resistance junction-ambient
UFBGA100
56



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