MB91F528 datasheet(236/241 Pages) SPANSION

No. de pieza	MB91F528

Descripción Electrónicos	This document states the current technical specifications regarding

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D at aS h ee t

208-pin plastic LQFP

Lead pitch

0.50 mm

Package width ×

package length

28.0 × 28.0 mm

Lead shape

Gullwing

Sealing method

Plastic mold

Mounting height

1.70 mm MAX

Weight

2.55 g

Code

(Reference)

P-LFQFP208-28×28-0.50

208-pin plastic LQFP

(FPT-208P-M06)

2003-2010 FUJITSU SEMICONDUCTOR LIMITED F208027S-c-3-5

Details of "A" part

0.25(.010)

(Stand off)

(.004±.002)

0.10±0.05

(.024±.006)

0.60±0.15

1.50

+0.20

–0.10

+.008

–.004

.059

0°~8°

"A"

0.08(.003)

(.006±.002)

0.145±0.055

INDEX

LEAD No.

104

105

156

157

208

0.50(.020)

0.08(.003) M

(.009±.002)

0.22±0.05

28.00±0.10(1.102±.004)SQ

30.00±0.20(1.181±.008)SQ

(Mounting height)

Dimensions in mm (inches).

Note: The values in parentheses are reference values.

Note 1) * : These dimensions do not include resin protrusion.

Note 2) Pins width and pins thickness include plating thickness.

Note 3) Pins width do not include tie bar cutting remainder.

Please confirm the latest Package dimension by following URL.

http://edevice.fujitsu.com/package/en-search/

March 28, 2014, MB91F528_DS705-00016-1v0-E

233

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