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PCF88331 Datasheet(PDF) 107 Page - NXP Semiconductors |
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PCF88331 Datasheet(HTML) 107 Page - NXP Semiconductors |
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107 / 112 page ![]() 2003 Feb 14 107 Philips Semiconductors Objective specification STN RGB - 132 × 132 × 3 driver PCF8833 Table 100 Bonding pad dimensions ITEM DIMENSIONS UNIT Minimum bump pitch columns: 46.464 µm all other: 52.800 Bump dimensions columns: 28.424 × 105.248 µm all other: 32.736 × 95.348 Bump height 15 µm Wafer thickness (excluding bumps) 381 µm handbook, full pagewidth MGU974 22.93 mm 2.34 mm PC8833-1 x y pitch Fig.61 Bonding pads dimensions. MGU975 handbook, halfpage x center y center 80 µm Fig.62 Alignment circle detail (80 µm diameter). |
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