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STLUX385ATR Datasheet(PDF) 117 Page - STMicroelectronics

No. de pieza STLUX385ATR
Descripción Electrónicos  Digital controllers for lighting and power conversion applications with up to 6 programmable PWM generators, 96 MHz PLL, DALI
PDF  126 Pages
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Fabricante Electrónico  STMICROELECTRONICS [STMicroelectronics]
Página de inicio  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STLUX385ATR Datasheet(HTML) 117 Page - STMicroelectronics

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STLUX
Thermal characteristics
126
13
Thermal characteristics
STLUX functionality cannot be guaranteed when the device operating exceeds the
maximum chip junction temperature (TJmax).
TJmax, in degrees Celsius, may be calculated using Equation 7:
Equation 7
TJmax = TAmax + PDmax x JA)
where:
TAmax is the maximum ambient temperature in °C
JA is the package junction to ambient thermal resistance in °C/W
PDmax is the sum of PINTmax and PI/Omax (PDmax = PINTmax + PI/Omax)
PINTmax is the product of IDD and VDD, expressed in watts. This is the maximum chip internal
power.
PI/Omax represents the maximum power dissipation on output pins where:
PI/Omax = (VOL * IOL) +  [(VDD - VOH) * IOH],
taking into account the actual VOL/IOL and VOH/IOH of the I/Os at low and high level.
Table 95. Package thermal characteristics
Symbol
Parameter
Value
Unit
JA
TSSOP38 - Thermal resistance junction to ambient(1)
1. Thermal resistance is based on the JEDEC JESD51-2 with the 4-layer PCB in a natural convection
environment.
80
°C/W
JA
VFQFPN32 - Thermal resistance junction to ambient(1)
26
°C/W
JA
TSSOP28 - Thermal resistance junction to ambient(1)
80
°C/W



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