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STM32F091CB Datasheet(PDF) 110 Page - STMicroelectronics

No. de pieza STM32F091CB
Descripción Electrónicos  ARM-based 32-bit MCU, up to 256 KB Flash, CAN, 12 timers, ADC, DAC & comm. interfaces, 2.0 - 3.6V
PDF  127 Pages
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Fabricante Electrónico  STMICROELECTRONICS [STMicroelectronics]
Página de inicio  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STM32F091CB Datasheet(HTML) 110 Page - STMicroelectronics

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STM32F091xB STM32F091xC
110/127
DocID026284 Rev 3
Figure 43. Recommended footprint for WLCSP64 package
b(2)
0.220
0.250
0.280
0.0087
0.0098
0.0110
D
3.312
3.347
3.382
0.1304
0.1318
0.1331
E
3.550
3.585
3.620
0.1398
0.1411
0.1425
e
-
0.400
-
-
0.0157
-
e1
-
2.800
-
-
0.1102
-
e2
-
2.800
-
-
0.1102
-
F
-
0.2735
-
-
0.0108
-
G
-
0.3925
-
-
0.0155
-
aaa
-
-
0.100
-
-
0.0039
bbb
-
-
0.100
-
-
0.0039
ccc
-
-
0.100
-
-
0.0039
ddd
-
-
0.050
-
-
0.0020
eee
-
-
0.050
-
-
0.0020
1. Values in inches are converted from mm and rounded to 4 decimal digits.
2. Dimension is measured at the maximum bump diameter parallel to primary datum Z.
Table 76. WLCSP64 recommended PCB design rules
Dimension
Recommended values
Pitch
0.4
Dpad
260 µm max. (circular)
220 µm recommended
Dsm
300 µm min. (for 260 µm diameter pad)
PCB pad design
Non-solder mask defined via underbump allowed.
Table 75. WLCSP64 package mechanical data (continued)
Symbol
millimeters
inches(1)
Min
Typ
Max
Min
Typ
Max



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