The **ATS-01B-173-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed for cooling electronic components like CPUs, GPUs, or power modules. --- ### 1. Technical Specifications The following table summarizes the primary physical and thermal characteristics of this part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 30.00mm | | **Thermal Resistance** | 4.91°C/W (at 100 LFM) | | **Attachment Method** | Push-pin (Brass) | | **Spring Type** | Compression Spring | | **Thermal Interface Material** | T412 (Pre-applied) | --- ### 2. Key Electronic Features #### A. pushPIN™ Mounting System The part uses a specialized "push-pin" mechanism. This is critical for electronics because it ensures **consistent pressure** across the component surface, which optimizes heat transfer and prevents the PCB from warping. #### B. Thermal Interface Material (T412) The "C3" in the part number indicates the specific thermal interface material. **T412** is a high-performance thermal pad that fills microscopic air gaps between the heat source and the heat sink, significantly lowering thermal resistance. #### C. Fin Design (Cross-Cut) The heat sink features a **straight-fin** or cross-cut geometry. In electronics, this design is ideal for systems with forced-air cooling (fans), as it maximizes surface area while maintaining a manageable pressure drop. --- ### 3. Application Use Cases * **Embedded Systems:** Cooling small-form-factor processors. * **Telecommunications:** Used on high-speed data chips that generate significant heat in tight enclosures. * **Power Electronics:** Dissipating heat from MOSFETs or voltage regulators. --- ### 4. Comparison of Thermal Resistance (Airflow Dependent) | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 4.91 | | 300 | 1.5 | 2.13 | | 500 | 2.5 | 1.63 | | 700 | 3.5 | 1.41 |