The **ATS-04H-11-C1-R0** is a high-performance electronic cooling component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications The following table breaks down the physical and thermal properties of this specific part number: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 50mm x 50mm x 10mm | | **Thermal Resistance** | 18.77°C/W (Unducted Flow @ 100 LFM) | | **Fin Style** | Straight Fin | | **Compliance** | RoHS Compliant | --- ### 2. Key Components & Design Features #### A. The pushPIN™ Attachment System Unlike adhesive-based heat sinks, the "R0" series uses a mechanical **pushPIN™** system. This consists of: * **Plastic/Brass Pins:** Inserted through pre-drilled holes in the PCB. * **Compression Springs:** Provides precise, uniform pressure (load) across the component surface to maximize thermal interface contact. #### B. Material and Coating * **Aluminum Construction:** Offers a balance of lightweight design and high thermal conductivity. * **Blue Anodized Finish:** This is not just aesthetic; anodizing increases the surface emissivity, which slightly improves radiant heat transfer and provides corrosion resistance. #### C. Low Profile Geometry With a height of only **10mm**, this part is specifically engineered for "low-profile" electronic environments where vertical space is limited, such as 1U rack servers, blade modules, or small form factor (SFF) embedded systems. --- ### 3. Thermal Performance Analysis The efficiency of this heat sink depends heavily on the airflow (measured in Linear Feet per Minute - LFM): * **Natural Convection:** Without a fan, the thermal resistance is high, making it suitable only for low-power chips. * **Forced Convection:** In a ducted system with high-speed fans, the thermal resistance drops significantly (down to approximately **1.45°C/W** at 800 LFM), allowing it to handle much higher TDP (Thermal Design Power) components. --- ### 4. Part Number Breakdown Understanding the ATS nomenclature: * **ATS:** Manufacturer (Advanced Thermal Solutions) * **04:** Series/Type * **H:** High-performance fin density * **11:** Specific height/dimensions code * **C1:** Blue Anodized finish * **R0:** Revision/Packaging code