The **ATS-06B-173-C3-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is specifically designed for cooling electronic components such as CPUs, GPUs, and high-power semiconductors. --- ### 1. Technical Specifications The part belongs to the **pushPIN™** series, which is known for its tool-free mounting and reliable thermal performance. | Attribute | Specification | | :--- | :--- | | **Material** | Aluminum | | **Fin Type** | Cross-Cut (allows for multi-directional airflow) | | **Mounting Style** | Push-Pin (Plastic or Brass options) | | **Dimensions** | 30.00mm x 30.00mm | | **Height** | 30.00mm | | **Thermal Resistance** | 4.91°C/W (at 100 LFM) | | **Attachment** | pushPIN™ with compression springs | | **Thermal Interface (TIM)** | T412 (Pre-applied) | --- ### 2. Key Components & Design Features #### A. The Fin Geometry (Cross-Cut) Unlike straight-fin heat sinks, the **Cross-Cut** pattern breaks up the boundary layer of the air. This design is ideal for systems where the airflow direction might not be perfectly linear, as it allows air to enter and exit from multiple angles. #### B. The pushPIN™ Mechanism The attachment system consists of: * **Push-Pins:** These secure the heat sink to the PCB through pre-drilled holes. * **Compression Springs:** These provide precise, constant pressure on the electronic component, ensuring optimal contact with the Thermal Interface Material (TIM). #### C. Thermal Interface Material (T412) The part comes with **T412** pre-applied. This is a high-performance thermal grease or pad that fills microscopic air gaps between the component die and the heat sink base, significantly reducing thermal resistance. --- ### 3. Application Use Cases This specific heat sink is typically used in space-constrained environments that require vertical clearance: * **Embedded Systems:** Industrial PCs and controllers. * **Telecommunications:** Networking switches and routers. * **Power Electronics:** Voltage regulators and high-speed memory modules. --- ### 4. Thermal Performance Data Performance varies based on the Airflow (LFM - Linear Feet per Minute): | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 4.91 | | 200 (1.0 m/s) | 2.73 | | 300 (1.5 m/s) | 2.23 | | 400 (2.0 m/s) | 1.97 | ---