The **ATS-06C-88-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed for cooling electronic components such as CPUs, GPUs, or high-power transistors on a Printed Circuit Board (PCB). --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific part: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Attachment Method** | Push-Pin (Brass) | | **Fin Style** | Straight (High-density) | | **Thermal Resistance** | 2.30°C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 35mm x 35mm x 25mm | | **Finish** | Blue Anodized | | **TIM (Interface Material)** | T766 (Pre-applied) | --- ### 2. Breakdown of the Model Number The part number follows a specific nomenclature used by Advanced Thermal Solutions: * **ATS:** Manufacturer prefix (Advanced Thermal Solutions). * **06:** Product series/family. * **C:** Attachment type (typically indicates Push-Pin mechanism). * **88:** Specific fin geometry and density code. * **C2:** Material/Finish code (Blue Anodized Aluminum). * **R0:** Revision or packaging code. --- ### 3. Key Electronic Components Features #### A. Thermal Interface Material (TIM) The "C2" suffix often indicates that the heat sink comes with **T766** pre-applied. This is a high-performance phase-change material that fills microscopic air gaps between the electronic component (die) and the heat sink base, significantly reducing thermal resistance. #### B. Push-Pin Attachment Instead of using messy adhesives or thermal tape, this part uses a mechanical **Push-Pin and Spring** system. * **Electronic Safety:** Prevents the heat sink from shifting during vibration or shipping. * **Controlled Pressure:** The springs ensure consistent downward force, which is critical for maintaining optimal thermal contact without cracking sensitive silicon dies. #### C. Fin Geometry The "Straight Fin" design is optimized for **forced air cooling** (active airflow from a fan). The high density of the aluminum fins provides a large surface area for heat dissipation while maintaining a compact footprint (35mm) suitable for dense PCB layouts. --- ### 4. Typical Applications * **Processors:** Cooling small BGA (Ball Grid Array) processors. * **Power Electronics:** Dissipating heat from MOSFETs or voltage regulators. * **Telecommunications:** Used in routers and switches where vertical space is available (25mm height).