The **ATS-06F-45-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" series designed for securing the cooling element directly to a Printed Circuit Board (PCB). --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Series** | pushPIN™ Heat Sink Assembly | | **Material** | Aluminum (Blue Anodized) | | **Attachment Type** | Push Pin (with Spring) | | **Dimensions (L x W)** | 30.00mm x 30.00mm | | **Height** | 20.00mm | | **Thermal Resistance** | 15.02°C/W (Unducted Flow @ 100 LFM) | | **Thermal Interface Material** | T412 (Pre-applied) | --- ### 2. Design and Construction The electronic and mechanical design of this part focuses on maximizing surface area for heat dissipation while maintaining a small footprint on the PCB. #### A. Fin Profile (Fine Pitch) * The **"F"** in the part number denotes a **Fine-Pitch** fin design. * Fine-pitch fins provide a larger surface area, which is ideal for high-velocity airflow environments (ducted or active fan cooling). #### B. Attachment Mechanism (Push Pin) * Unlike adhesive-based heat sinks, this uses a **Push Pin** system. * **Benefits:** It provides consistent pressure on the processor/chip, improving heat transfer and ensuring the heat sink stays mounted even during vibration or mechanical shock. #### C. Thermal Interface Material (TIM) * The unit comes with **T412** pre-applied. This is a high-performance phase-change material or thermal grease that fills microscopic air gaps between the component (CPU/GPU/FPGA) and the heat sink base. --- ### 3. Application Use Cases This specific model is typically used for cooling small-to-mid-sized integrated circuits (ICs) that generate significant heat relative to their size: * **Telecommunications:** Network switches and routers. * **Embedded Systems:** Industrial PC processors. * **Power Electronics:** Voltage regulators and high-speed MOSFETs. * **Automation:** Control modules requiring passive cooling in forced-air environments. --- ### 4. Thermal Performance Comparison Below is a simplified view of how the thermal resistance changes based on airflow (measured in Linear Feet per Minute): | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 15.02 | | 300 (1.5 m/s) | 6.30 | | 500 (2.5 m/s) | 4.60 | | 700 (3.5 m/s) | 3.86 | ---