The **ATS-07G-137-C2-R0** is a high-performance heat sink manufactured by Advanced Thermal Solutions (ATS). It belongs to the **push-pin** attachment family, specifically designed for cooling electronic components such as processors, chipsets, or power modules. ### 1. Key Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-07G-137-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Type** | Push-Pin (Plastic) | | **Thermal Resistance** | 18.3°C/W (Unducted Flow @ 200 LFM) | | **Dimensions (L x W x H)** | 18mm x 18mm x 10mm | --- ### 2. Design and Component Breakdown #### A. The Heat Sink Body (Heatsink) * **Geometry:** It features a **Straight-Fin** design. This allows for optimal airflow in one direction, making it ideal for systems with directed chassis fans. * **Material:** Made from high-grade aluminum for a balance between weight and thermal conductivity. * **Surface Treatment:** The "Blue Anodized" finish isn't just for aesthetics; it provides surface protection and slightly improves radiation heat transfer. #### B. The Attachment Mechanism (Push-Pins) * **Hardware:** It uses pre-assembled plastic push-pins and compression springs. * **Function:** These provide a consistent "clamping force" onto the electronic component, ensuring that the interface between the chip and the heat sink remains tight even under vibration. * **Hole Pattern:** It requires specific pre-drilled holes in the PCB to snap the pins into place. #### C. Thermal Interface Material (TIM) * **Pre-Applied:** This specific model usually comes with **ATS-NO-TIM** or a pre-applied thermal pad/grease on the base. This eliminates the need for manual application during assembly. --- ### 3. Application Use Cases This part is typically found in: 1. **Network Switches:** Cooling small ASICs or controllers. 2. **Embedded Systems:** For industrial PCs where space is limited. 3. **Power Electronics:** Dissipating heat from voltage regulators or small transistors. --- ### 4. Comparison of Airflow Performance The performance of this part is highly dependent on the "Velocity" of the air provided by system fans: | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 (1.0 m/s) | 18.3 | | 400 (2.0 m/s) | 13.5 | | 600 (3.0 m/s) | 11.2 |