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  • ATS-10A-143-C3-R0

  • AI
    The **ATS-10A-143-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed for cooling electronic components such as CPUs, GPUs, and power transistors. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions** | 30.00mm x 30.00mm x 10.00mm | | **Thermal Resistance** | 24.52°C/W (Unducted @ 100 LFM) | | **Fin Style** | Straight Fin | | **Thermal Interface (TIM)** | T412 (High Performance) | --- ### 2. Key Electronic Features #### A. pushPIN™ Mounting System The "10A" series utilizes a specialized mounting mechanism. Instead of using messy thermal adhesives or tape, it uses a **spring-loaded push-pin** system. * **Uniform Pressure:** Ensures consistent contact between the heat sink and the component surface. * **Mechanical Stability:** Protects the electronic part from vibration and mechanical shock. #### B. High-Performance TIM (T412) The "C3" suffix indicates the inclusion of a high-performance **Thermal Interface Material**. * This material fills the microscopic air gaps between the heat sink and the electronic chip. * T412 provides low thermal impedance and high reliability under thermal cycling. #### C. Optimized Fin Geometry The straight-fin design is optimized for **forced air cooling**. In electronic enclosures with fans, the air flows through these fins to carry heat away from the sensitive silicon junctions. --- ### 3. Application Use Cases This specific model is typically used for small-to-medium electronic modules, including: 1. **Network Switches:** Cooling ASICs and controllers. 2. **Embedded Systems:** Industrial PCs where space is limited (10mm height). 3. **Power Electronics:** Dissipating heat from MOSFETs or Voltage Regulators (VRMs). --- ### 4. Part Number Breakdown * **ATS:** Advanced Thermal Solutions * **10A:** Part series (pushPIN™ type) * **143:** Dimensional designator (30x30x10mm) * **C3:** Performance grade / TIM coating (T412) * **R0:** Revision/Packaging code
    ✨ Follow-up Questions
    • How do I calculate the airflow required to achieve a specific temperature drop with this heat sink?
    • What are the advantages of blue anodized finishes in electronic cooling?
    • Are there alternative mounting methods if my PCB doesn't have holes for push-pins?