ATS-10A-143-C3-R0
AI

The **ATS-10A-143-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed for cooling electronic components such as CPUs, GPUs, and power transistors.
---
### 1. Technical Specifications
Below are the primary physical and thermal characteristics of this part:
| Parameter | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Dimensions** | 30.00mm x 30.00mm x 10.00mm |
| **Thermal Resistance** | 24.52°C/W (Unducted @ 100 LFM) |
| **Fin Style** | Straight Fin |
| **Thermal Interface (TIM)** | T412 (High Performance) |
---
### 2. Key Electronic Features
#### A. pushPIN™ Mounting System
The "10A" series utilizes a specialized mounting mechanism. Instead of using messy thermal adhesives or tape, it uses a **spring-loaded push-pin** system.
* **Uniform Pressure:** Ensures consistent contact between the heat sink and the component surface.
* **Mechanical Stability:** Protects the electronic part from vibration and mechanical shock.
#### B. High-Performance TIM (T412)
The "C3" suffix indicates the inclusion of a high-performance **Thermal Interface Material**.
* This material fills the microscopic air gaps between the heat sink and the electronic chip.
* T412 provides low thermal impedance and high reliability under thermal cycling.
#### C. Optimized Fin Geometry
The straight-fin design is optimized for **forced air cooling**. In electronic enclosures with fans, the air flows through these fins to carry heat away from the sensitive silicon junctions.
---
### 3. Application Use Cases
This specific model is typically used for small-to-medium electronic modules, including:
1. **Network Switches:** Cooling ASICs and controllers.
2. **Embedded Systems:** Industrial PCs where space is limited (10mm height).
3. **Power Electronics:** Dissipating heat from MOSFETs or Voltage Regulators (VRMs).
---
### 4. Part Number Breakdown
* **ATS:** Advanced Thermal Solutions
* **10A:** Part series (pushPIN™ type)
* **143:** Dimensional designator (30x30x10mm)
* **C3:** Performance grade / TIM coating (T412)
* **R0:** Revision/Packaging code
- ⤷
How do I calculate the airflow required to achieve a specific temperature drop with this heat sink?
- ⤷ What are the advantages of blue anodized finishes in electronic cooling?
- ⤷ Are there alternative mounting methods if my PCB doesn't have holes for push-pins?