### Overview of ATS-13E-141-C2-R0 The **ATS-13E-141-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **blueICE™** series and is specifically designed for cooling electronic components such as CPUs, GPUs, and other high-heat integrated circuits. --- ### Technical Specifications The following table outlines the physical and thermal characteristics of this specific component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 10.00mm | | **Thermal Resistance** | 15.70° C/W (@ 100 LFM) | | **Attachment Method** | pushPIN™ | | **Spring Type** | ATS-PP-05 | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### Key Electronic & Mechanical Components #### 1. Heat Sink Body The body is made of extruded aluminum. Its primary function is to increase the surface area available for heat dissipation. The "Blue Anodized" coating is not just for aesthetics; it provides corrosion resistance and slightly improves emissivity. #### 2. pushPIN™ Attachment System Unlike adhesive-based heat sinks, this part uses a mechanical **pushPIN™** system. This consists of: * **Compression Springs:** Provide constant pressure to ensure the thermal interface material makes perfect contact with the electronic chip. * **Plastic/Brass Pins:** Secure the heat sink through pre-drilled holes in the Printed Circuit Board (PCB). #### 3. Thermal Interface Material (TIM) The base comes pre-applied with **T766**. This is a phase-change material or high-performance thermal grease that fills the microscopic air gaps between the heat sink and the electronic component, significantly reducing thermal resistance. --- ### Performance Data (Airflow) Electronic cooling efficiency is measured by thermal resistance based on the Velocity of air (Linear Feet per Minute - LFM): | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 15.70 | | 300 (1.5 m/s) | 9.30 | | 500 (2.5 m/s) | 7.50 | | 700 (3.5 m/s) | 6.50 | --- ### Application in Electronics This part is typically used in: * **Embedded Systems:** For cooling microcontrollers in tight enclosures. * **Telecommunications:** To manage heat in network switches or routers. * **Power Electronics:** Dissipating heat from MOSFETs or voltage regulators.