The **ATS-13F-44-C1-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** designed by Advanced Thermal Solutions (ATS). It is part of the "push pin" attachment series, commonly used for cooling BGA (Ball Grid Array) components like CPUs, GPUs, or FPGAs. ### 1. Technical Specifications The following table summarizes the primary mechanical and thermal properties of this part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-13F-44-C1-R0 | | **Material** | Aluminum (Blue Anodized) | | **Attachment Type** | Push Pin (Brass) | | **Fin Style** | Fine Pitch (Straight Fin) | | **Dimensions (L x W x H)** | 37.00mm x 37.00mm x 10.00mm | | **Thermal Resistance** | 20.28°C/W (at 200 LFM) | | **Spring Type** | Compression Spring | --- ### 2. Key Components & Design The "electronic parts" of this assembly are purely mechanical-thermal, intended to protect sensitive electronic silicon from heat failure. #### A. The Heat Sink Body The body is constructed from extruded aluminum. The **Blue Anodized** finish isn't just for aesthetics; it provides surface protection and slightly increases thermal emissivity, helping radiation heat transfer. #### B. Push Pin Attachment Mechanism Instead of using messy thermal adhesives or tapes, this model uses **Brass Push Pins**. * **The Pin:** Fits into pre-drilled holes on the Printed Circuit Board (PCB). * **The Spring:** Provides a specific "Normal Force" (measured in PSI) to ensure the heat sink remains in constant contact with the chip, even during mechanical vibration. #### C. Thermal Interface Material (TIM) The "R0" suffix typically indicates that the part comes with **no pre-applied thermal interface material**, or a specific standard pad. Users generally apply their own thermal grease or phase-change material between the chip surface and the aluminum base to fill microscopic air gaps. --- ### 3. Thermal Performance Profile The efficiency of this part depends heavily on the airflow (LFM - Linear Feet per Minute) inside the electronic enclosure: | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **200 (Unducted)** | 20.28 | | **400 (Unducted)** | 12.60 | | **600 (Unducted)** | 10.10 | --- ### 4. Application Use Case This part is typically found in: * **Network Switches:** Cooling high-speed processing chips. * **Industrial PCs:** Where vibration resistance is required (provided by the push-pins). * **Embedded Systems:** Where the low profile (10mm height) is necessary for slim enclosures. ---