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  • ATS-13H-06-C2-R0

  • AI
    The **ATS-13H-06-C2-R0** is a specific electronic component categorized as a **High-Performance Heat Sink**, manufactured by Advanced Thermal Solutions (ATS). It belongs to the **push-pin** attachment series and is designed for cooling integrated circuits (ICs) such as CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Dimensions (L x W x H)** | 45mm x 45mm x 25mm | | **Thermal Resistance** | 2.01 °C/W (@ 200 LFM) | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### 2. Physical Design and Construction The ATS-13H-06-C2-R0 utilizes a **Straight Fin** design. This geometry is optimized for forced air cooling environments where airflow is directed linearly across the fins. * **Heat Sink Base:** Flat aluminum base to ensure maximum contact with the component surface. * **Fin Pitch:** Engineered to balance surface area with pressure drop, ensuring air can move through the sink effectively. * **Push-Pin Mechanism:** Features a spring-loaded push-pin assembly. This provides consistent pressure (preload) across the component, which is critical for maintaining a stable thermal bond over time. --- ### 3. Thermal Performance Indicators Thermal performance is measured by the temperature rise per watt of power dissipated. For the ATS-13H-06-C2-R0, the performance varies based on air velocity (measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **200 (1.0 m/s)** | 2.01 | | **400 (2.0 m/s)** | 1.18 | | **600 (3.0 m/s)** | 0.92 | --- ### 4. Component Identification (Part Number Breakdown) The part number provides specific details about the configuration: * **ATS:** Manufacturer prefix. * **13:** Series/Designator. * **H:** High-performance fin profile. * **06:** Specific dimension/configuration code. * **C2:** Blue Anodized finish. * **R0:** Revision or packaging code. ---
    ✨ Follow-up Questions
    • What are the advantages of using push-pins over adhesive tape for heat sinks?
    • How does the T766 thermal interface material compare to standard thermal grease?
    • Can this heat sink be used in passive cooling applications without a fan?