The part number **ATS-13H-07-C1-R0** refers to a high-performance **Heatsink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push-pin" series designed for cooling electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications The part number itself is an alphanumeric code that describes the physical and thermal properties of the device. | Property | Value / Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Base Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass) | | **Spring Type** | Compression Spring | | **Thermal Resistance** | 16.97°C/W (Unducted) | | **Dimensions (L x W x H)** | 45mm x 45mm x 12.7mm | --- ### 2. Breakdown of the Part Number The nomenclature can be dissected to understand the exact configuration: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **13H**: Part of the standard product family. * **07**: Specific size/height profile code. * **C1**: Material and Thermal Interface Material (TIM) type (typically indicates Aluminum with a pre-applied thermal pad). * **R0**: RoHS compliance and revision status. --- ### 3. Key Electronic Functions While a heatsink is a passive mechanical part, its role in an electronic circuit is critical for **Thermal Management**: 1. **Heat Dissipation**: It increases the surface area of the heat-generating component, allowing air to carry heat away more efficiently. 2. **Thermal Interface**: The "C1" designation usually implies the presence of a **Thermal Interface Material (TIM)** on the base. This fills microscopic air gaps between the chip and the heatsink to lower thermal resistance. 3. **Mechanical Attachment**: The **Push-Pin** system uses a spring-loaded mechanism. This ensures constant pressure (clamping force) on the electronic component, which is vital for maintaining thermal contact over the product's lifespan. --- ### 4. Application Environments This specific heatsink is commonly used in: * **Networking Hardware**: Switches and routers. * **Embedded Systems**: Industrial PCs and controllers. * **Power Supplies**: Dissipating heat from MOSFETs or voltage regulators.