The **ATS-14G-26-C1-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" attachment series designed for cooling integrated circuits (ICs). --- ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass) | | **Spring Type** | Compression Spring | | **Thermal Resistance** | 14.14°C/W (Unducted @ 100 LFM) | | **Dimensions (L x W)** | 70mm x 70mm | | **Height** | 10mm | | **Fin Style** | Square Pin Fin | --- ### 2. Physical Design Features * **Pin Fin Geometry:** Unlike traditional straight-fin heat sinks, the square pin fin design allows for omnidirectional airflow. This makes it highly effective in environments where the direction of the airflow is inconsistent or turbulent. * **Low Profile:** With a height of only 10mm, this part is ideal for high-density electronic assemblies, such as blade servers or small-form-factor telecommunications equipment. * **Thermal Interface Material (TIM):** This specific model typically comes with **Saint-Gobain C8000** phase-change material pre-applied to the base, ensuring optimal heat transfer between the component and the sink. --- ### 3. Mechanical Integration The push-pin mounting system provides a secure, vibration-resistant attachment to the PCB. ```yaml # Mounting Requirements Hole_Pattern: 63mm (Standard ATS layout) Hole_Size: 3.0mm Pin_Material: Brass Spring_Force: High-Pressure (to ensure TIM wet-out) ``` --- ### 4. Common Applications * **BGA Cooling:** Primarily used for Ball Grid Array (BGA) components like CPUs, FPGAs, and ASICs. * **Networking Gear:** Switches and routers where horizontal airflow is common. * **Power Supplies:** Cooling MOSFETs or power conversion modules.