The **ATS-56001-C1-R0** is a high-performance thermal management component, specifically an **Advanced Thermal Solutions (ATS) maxiFLOW™ Heat Sink**. While it is not an active electronic component (like an IC), it is a critical mechanical-electronic part designed for cooling high-heat density electronic devices. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | maxiFLOW™ | | **Material** | Aluminum (Anodized Blue) | | **Dimensions** | 19.0mm x 19.0mm x 14.5mm (L x W x H) | | **Attachment Method** | maxiGRIP™ (Frame Clip) | | **Thermal Resistance** | 8.2° C/W @ 200 LFM | | **Interface Material** | T766 (High Performance Thermal Pad) | --- ### 2. Key Design Elements #### A. maxiFLOW™ Fin Geometry The "C1" in the part number often refers to the specific fin density or configuration. The maxiFLOW design features a **flared fin structure**. This increases the surface area and enhances convection cooling by allowing air to enter from multiple directions, which is superior to standard straight-fin extrusions. #### B. maxiGRIP™ Attachment System This part utilizes a specialized mechanical fastening system consisting of two main pieces: 1. **Plastic Frame Clip:** Replaces the need for permanent adhesives or drilling holes in the PCB. 2. **Stainless Steel Spring Clip:** Applies steady, even pressure across the electronic component (CPU, FPGA, or GPU), ensuring optimal thermal contact. #### C. Thermal Interface Material (TIM) The unit comes pre-applied with **T766**, a high-performance phase-change thermal interface material. This ensures there are no air gaps between the heat source and the aluminum base, maximizing heat transfer efficiency. --- ### 3. Typical Applications This specific small-form-factor heat sink is commonly found in: * **Networking Hardware:** Cooling small ASICs and chipsets in routers and switches. * **Telecommunications:** Cooling optical modules or signal processors. * **Embedded Systems:** Protecting SoCs (System on Chips) in industrial computing. ---