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  • ATS-H1-101-C1-R0

  • AI
    The **ATS-H1-101-C1-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions, Inc. (ATS)*. It belongs to the **pushPIN™** series, designed for secure and efficient cooling of electronic components like CPUs, GPUs, or FPGAs. --- ### 1. Key Technical Specifications Below are the primary physical and thermal characteristics of the part: | Feature | Specification | | :--- | :--- | | **Dimensions (L x W x H)** | 45mm x 45mm x 20mm | | **Material** | Aluminum (AL6063) | | **Fin Style** | Straight Fin | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 1.14 °C/W (at 200 LFM) | | **Finish** | Blue Anodized | --- ### 2. Breakdown of the Part Number The part number is coded to represent specific engineering attributes: * **ATS:** Manufacturer (Advanced Thermal Solutions). * **H1:** Specific series or height profile indicator. * **101:** Part sequence ID within the series. * **C1:** Material/Color code (typically signifies specific aluminum grade and blue anodization). * **R0:** Revision code (Standard version). --- ### 3. Core Component Features #### A. Thermal Performance This heat sink uses a **straight-fin** design which is optimized for airflow in a single direction. The thermal resistance of **1.14 °C/W** indicates that for every watt of heat dissipated, the component temperature will rise by 1.14 degrees Celsius above the ambient air temperature (assuming optimal airflow). #### B. pushPIN™ Attachment System Instead of using messy thermal adhesives or simple clips, this part uses the **pushPIN™** system: * **Integrated Spring:** Provides constant pressure (Force) to ensure maximum contact with the electronic component. * **Secure Fit:** Reduces the risk of the heat sink shifting during vibration or shipping. * **Installation:** Requires pre-drilled holes on the Printed Circuit Board (PCB). #### C. Material and Finish * **AL6063 Aluminum:** Chosen for its excellent thermal conductivity and structural integrity. * **Blue Anodized Finish:** Not only provides a professional aesthetic but also adds a layer of corrosion resistance and slightly improves radiant heat emission. --- ### 4. Application Use Cases This part is typically found in: * **Networking Equipment:** High-speed routers and switches. * **Industrial PCs:** Cooling embedded processors in harsh environments. * **Power Supplies:** Managing heat for MOSFETs or voltage regulators.
    ✨ Follow-up Questions
    • What are the required PCB hole diameters for the pushPIN attachment?
    • Can this heat sink be used with a custom thermal interface material (TIM)?
    • How does the thermal resistance change at higher airflow speeds (e.g.
    • 500 LFM)?