The **ATS-P2-32-C2-R0** is a high-performance electronic thermal management component manufactured by **Advanced Thermal Solutions (ATS)**. It is a heat sink designed specifically for the cooling of electronic components such as CPUs, GPUs, and high-density power modules. ### 1. Technical Specifications The following table summarizes the key physical and thermal characteristics of the part: | Parameter | Specification | | :--- | :--- | | **Part Number** | ATS-P2-32-C2-R0 | | **Heat Sink Type** | pushPIN™ Heat Sink Assembly | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Plastic Pins & Springs) | | **Thermal Resistance** | 24.98 °C/W (Unducted Flow @ 100 LFM) | | **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 15.00mm | | **Fine Pitch/Pattern** | Straight Fin | --- ### 2. Key Design Features * **pushPIN™ Attachment:** This model uses a specialized attachment mechanism consisting of a plastic pin and a high-performance compression spring. This ensures a secure, uniform pressure across the component surface for optimal heat transfer. * **Straight Fin Design:** The "Straight Fin" geometry is optimized for high-velocity airflow environments (ducted or unducted). * **Thermal Interface Material (TIM):** The part typically comes pre-applied with **T766** thermal phase-change material, which eliminates the need for manual thermal paste application and ensures low contact resistance. * **Blue Anodized Coating:** This surface treatment increases surface emissivity and provides corrosion resistance while giving it a professional aesthetic. ### 3. Electronic Application Use-Cases The ATS-P2-32-C2-R0 is commonly used in the following electronic sectors: 1. **Telecommunications:** Cooling of high-speed ASICs in networking switches and routers. 2. **Embedded Systems:** Thermal management for compact industrial PC processors. 3. **Power Electronics:** Managing heat in MOSFET arrays or voltage regulators within power supply units. 4. **FPGA/Microcontrollers:** Suitable for BGA (Ball Grid Array) packages that generate significant heat in a small footprint (30mm x 30mm). --- ### 4. Thermal Performance Comparison Thermal performance varies based on the air velocity (LFM - Linear Feet per Minute): | Air Velocity (LFM) | 100 | 200 | 400 | 600 | | :--- | :---: | :---: | :---: | :---: | | **Thermal Resistance (°C/W)** | 24.98 | 12.85 | 8.10 | 6.67 |