CLA0930003JBEG
AI

The **CLA0930003JBEG** is a high-performance, low-profile **Multi-Layer Ceramic Chip Antenna (MLCC Antenna)** manufactured by **Inpaq Technology**. It is specifically designed for integration into mobile and compact wireless devices.
Below is a detailed breakdown of its electronic specifications and characteristics.
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### 1. General Specifications
The CLA series utilizes Low Temperature Co-fired Ceramic (LTCC) technology to achieve high stability and efficiency in a surface-mount package.
| Parameter | Specification |
| :--- | :--- |
| **Manufacturer** | Inpaq Technology |
| **Frequency Range** | 2.4 GHz - 2.5 GHz (ISM Band) |
| **Package Size** | 9.0 x 3.0 x 1.1 mm |
| **Mounting Type** | Surface Mount (SMD) |
| **Impedance** | 50 $\Omega$ |
| **Polarization** | Linear |
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### 2. Electronic Performance Characteristics
This part is optimized for Bluetooth, Wi-Fi, and ZigBee applications. Its performance is highly dependent on the Ground Plane design of the PCB it is mounted on.
* **Bandwidth:** Typically covers the 2400MHz to 2500MHz spectrum.
* **Peak Gain:** Generally ranges between **2.0 dBi to 3.5 dBi**, depending on the PCB layout and clearance zones.
* **Efficiency:** High radiation efficiency (usually >70%) due to the ceramic material's low dielectric loss.
* **VSWR:** Voltage Standing Wave Ratio is typically **< 2.0** at the resonant frequency.
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### 3. Key Design Requirements
Because this is a chip antenna, its electronic behavior is shaped by its physical environment:
1. **Clearance Zone:** The antenna requires a "keep-out" area (copper-free zone) on all layers of the PCB directly beneath and surrounding the part to prevent signal interference and detuning.
2. **Matching Network:** To ensure a perfect 50 Ohm match, a Pi-matching circuit (Shunt-Series-Shunt components) is usually required between the RF transceiver and the antenna.
3. **Feeding Point:** The signal is fed into one end of the ceramic body, while the other pads are used for mechanical stability or frequency tuning.
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### 4. Applications
The CLA0930003JBEG is commonly found in the following electronic devices:
* **IoT Devices:** Smart home sensors and controllers.
* **Wearables:** Fitness trackers and smartwatches.
* **Audio:** Bluetooth headsets and wireless speakers.
* **Computing:** Wi-Fi dongles and compact wireless modules.
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- ⤷
What is the recommended PCB clearance area for this antenna?
- ⤷ How do I calculate the matching network components for a 2.4GHz chip antenna?
- ⤷ What are the soldering profile requirements for LTCC ceramic antennas?