INMP411ACEZ-R0
AI

The **INMP411ACEZ-R0** is a high-performance, high-SPL (Sound Pressure Level), analog-output bottom-port MEMS microphone. It is designed by TDK InvenSense to handle loud environments without distortion while maintaining a small footprint.
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### ## Technical Specifications
Below are the primary electrical and performance characteristics of the component:
| Parameter | Specification |
| :--- | :--- |
| **Output Type** | Analog (Single-Ended) |
| **Directionality** | Omnidirectional |
| **Sensitivity** | -46 dBV |
| **Signal-to-Noise Ratio (SNR)** | 62 dBA |
| **Acoustic Overload Point (AOP)** | 131 dB SPL |
| **Supply Voltage (Vdd)** | 1.5V to 3.6V |
| **Current Consumption** | 200 µA (typical) |
| **Frequency Response** | 28 Hz to 20 kHz |
| **Package** | 3.35 mm × 2.50 mm × 0.98 mm (LGA) |
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### ## Key Features and Internal Architecture
### 1. High Acoustic Overload Point (AOP)
The standout feature of the INMP411 is its ability to record audio up to **131 dB SPL**. This makes it ideal for applications where the environment is extremely loud (e.g., rock concerts, wind noise, or heavy machinery) where standard MEMS microphones would clip or distort the signal.
### 2. MEMS Sensor and Pre-amplifier
The device consists of two main internal stages:
* **MEMS Transducer:** A silicon diaphragm that converts sound pressure into a change in capacitance.
* **Impedance Converter/Amplifier:** An internal ASIC that converts the capacitive change into a low-impedance analog voltage signal.
### 3. Power Supply Rejection (PSR)
The chip features internal filtering that provides high PSR, meaning it is less susceptible to noise coming from the power supply rails (e.g., switching noise from a DC-DC converter).
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### ## Typical Application Circuit
When integrating the INMP411, a few external components are required for stability and signal integrity:
```markdown
Vdd (1.8V - 3.3V) ----+-----------+
| |
[C1] 0.1uF (VDD Pin)
| |
GND ------------------+-----------(GND Pin)
|
(OUTPUT Pin) --[C2] 10uF--> To Codec/MCU ADC
```
* **C1 (Decoupling Capacitor):** Placed close to the VDD pin to filter power noise.
* **C2 (DC Blocking Capacitor):** Necessary because the analog output has a DC bias. A 10µF capacitor is typically used to ensure low-frequency sounds are not filtered out.
---
### ## Use Cases
* **Smartphones:** For video recording in loud environments.
* **Wearables:** Due to the ultra-low current consumption (200 µA).
* **Industrial Monitoring:** Detecting mechanical failures or high-decibel alarms.
* **Noise Cancellation:** As a reference microphone in ANC (Active Noise Cancellation) systems.
- ⤷
What are the PCB soldering requirements for the bottom-port LGA package?
- ⤷ How does the INMP411 compare to digital PDM microphones in terms of system complexity?
- ⤷ What is the impact of the DC blocking capacitor value on the low-frequency cutoff?