• 3939 size package with Kelvin terminals
• Ideal for all types of current sensing and pulse
applications including switching and linear
power supplies, instruments, power amplifiers,
shunts, and high power current sensing
modules
• Proprietary processing technique produces low
resistance values (2 mΩ to 8 mΩ)
• Solid metal manganese-copper and nickelchromium alloy resistive element with low TCR
(< 30 ppm/°C)
• Max. solder temperature up to 280 °C / 30 s or
250 °C / 5 min
• Very low inductance < 10 nH
• Finishes available for wire bonding, sintering, and
soldering (backside);
Electroless Nickel Immersion Gold (ENIG)
• Low thermal EMF (< 2 μV/°C)
• AEC-Q200 qualified