Applications
Mobile Equipment
Smartphones
Tablets
Notebook PCs
Desktop PCs

Features
(1) Suitable for use with a 5 V signal line. (VRWM ≤ 5.5 V)
(2) Protects devices with its high ESD performance.
(VESD = ±30 kV (Contact / Air) @IEC61000-4-2)
(3) Low dynamic resistance protects semiconductor devices from static electricity and noise.
(RDYN = 0.2 Ω (typ.))
(4) Snapback characteristics realizing low clamping voltage protects semiconductor devices.
(VC = 11 V@IPP = 4 A (typ.))
(5) Compact package is suitable for use in high density board layouts such as in mobile devices.
(0.8 mm × 1.2 mm size (Toshiba package name: ESC))