Features
 Glass passivated chip junction
 Ideally suited for automatic assembly
 Save space on printed circuit boards
 Ultra thin profile package for space constrained utilization
 Lead free in compliance with EU RoHS 2.0
 Halogen-free according to IEC 61249 standard

Mechanical Data
 Case : M4 Package
 Terminals : Solderable per MIL-STD-750, Method 2026
 Approx. Weight : 0.29 grams

Application
 QC/PD Charger
 General Console power
 NB Adapter
 Monitor Power
 Smart Speaker Power
 Slim Adapter